Da: Books in my Basket, New Delhi, India
EUR 7,68
Quantità: 5 disponibili
Aggiungi al carrelloSoft cover. Condizione: New. ISBN:9788184892321,Territorial restriction maybe printed on the book. This is an Int'l edition, ISBN and cover may differ from US edition, Contents same as US edition.
Lingua: Inglese
Editore: New Age International Publisher, 2009
ISBN 10: 8184892322 ISBN 13: 9788184892321
Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Condizione: New. Brand New. Soft Cover International Edition. Different ISBN and Cover Image. Priced lower than the standard editions which is usually intended to make them more affordable for students abroad. The core content of the book is generally the same as the standard edition. The country selling restrictions may be printed on the book but is no problem for the self-use. This Item maybe shipped from US or any other country as we have multiple locations worldwide.
Lingua: Inglese
Editore: New Age International Publisher, 2009
ISBN 10: 8184892322 ISBN 13: 9788184892321
Da: SMASS Sellers, IRVING, TX, U.S.A.
Condizione: New. Brand New, Softcover edition. This item may ship from the US or our Overseas warehouse depending on your location and stock availability.
Da: UK BOOKS STORE, London, LONDO, Regno Unito
EUR 35,26
Quantità: 19 disponibili
Aggiungi al carrelloPaperback. Condizione: New. Brand New ! Fast Delivery "International Edition " and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 4-6 Working days .and we do have flat rate for up to 2LB. Extra shipping charges will be requested This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.
Da: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germania
EUR 20,00
Quantità: 2 disponibili
Aggiungi al carrelloxxii, 281 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
Da: Basi6 International, Irving, TX, U.S.A.
Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Da: Antiquariaat Ovidius, Bredevoort, Paesi Bassi
EUR 96,00
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: Gebraucht / Used. Fine state d582e.
Lingua: Inglese
Editore: Springer-Nature New York Inc, 2025
ISBN 10: 9819510201 ISBN 13: 9789819510207
Da: Revaluation Books, Exeter, Regno Unito
EUR 112,60
Quantità: 2 disponibili
Aggiungi al carrelloPaperback. Condizione: Brand New. 400 pages. 9.25x6.10x9.21 inches. In Stock.
Lingua: Inglese
Editore: The Institution of Engineering and Technology, 2020
ISBN 10: 1785617974 ISBN 13: 9781785617973
Da: GreatBookPrices, Columbia, MD, U.S.A.
EUR 127,49
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Lingua: Inglese
Editore: Institution of Engineering and Technology, GB, 2020
ISBN 10: 1785617974 ISBN 13: 9781785617973
Da: Rarewaves USA, OSWEGO, IL, U.S.A.
EUR 129,81
Quantità: Più di 20 disponibili
Aggiungi al carrelloHardback. Condizione: New. Reliability has always been a major concern in designing computing systems. However, the increasing complexity of such systems has led to a situation where efforts for assuring reliability have become extremely costly, both for the design of solutions for the mitigation of possible faults, and for the reliability assessment of such techniques. Cross-layer reliability is fast becoming the preferred solution. In a cross-layer resilient system, physical and circuit level techniques can mitigate low-level faults. Hardware redundancy can be used to manage errors at the hardware architecture layer. Eventually, software implemented error detection and correction mechanisms can manage those errors that escaped the lower layers of the stack. This book presents state-of-the-art solutions for increasing the resilience of computing systems, both at single levels of abstraction and multi-layers. The book begins by addressing design techniques to improve the resilience of computing systems, covering the logic layer, the architectural layer and the software layer. The second part of the book focuses on cross-layer resilience, including coverage of physical stress, reliability assessment approaches, fault injection at the ISA level, analytical modelling for cross-later resiliency, and stochastic methods. Cross-Layer Reliability of Computing Systems is a valuable resource for researchers, postgraduate students and professional computer architects focusing on the dependability of computing systems.
Lingua: Inglese
Editore: The Institution of Engineering and Technology, 2020
ISBN 10: 1785617974 ISBN 13: 9781785617973
Da: California Books, Miami, FL, U.S.A.
EUR 130,77
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Lingua: Inglese
Editore: The Institution of Engineering and Technology, 2020
ISBN 10: 1785617974 ISBN 13: 9781785617973
Da: GreatBookPrices, Columbia, MD, U.S.A.
EUR 130,77
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 121,17
Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Condizione: New. 1st ed. 2018 edition NO-PA16APR2015-KAP.
Condizione: New. pp. 281.
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 86,08
Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book constitutes the refereed proceedings of the 16th International Symposium on Advanced Parallel Processing Technologies, APPT 2025, held in Athens, Greece, during July 13 16, 2025.The 17 full papers and 10 short papers included in this book were carefully reviewed and selected from 74 submissions. They were organized in topical sections as follows: Chip and Accelerators, Memory and Storage, Cloud and Networking, Design for LLM and ML/AI, Big Data and Graph Processing, and Secure and Dependable System.
Lingua: Inglese
Editore: The Institution of Engineering and Technology, 2020
ISBN 10: 1785617974 ISBN 13: 9781785617973
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 136,85
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Lingua: Inglese
Editore: The Institution of Engineering and Technology, 2020
ISBN 10: 1785617974 ISBN 13: 9781785617973
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 140,10
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Lingua: Inglese
Editore: The Institution of Engineering and Technology, 2020
ISBN 10: 1785617974 ISBN 13: 9781785617973
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 150,45
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
EUR 95,15
Quantità: 5 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Dependable Multicore Architectures at Nanoscale | Marco Ottavi (u. a.) | Taschenbuch | xxii | Englisch | 2018 | Springer | EAN 9783319853918 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Da: Buchpark, Trebbin, Germania
EUR 61,51
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: Sehr gut. Zustand: Sehr gut | Seiten: 440 | Sprache: Englisch | Produktart: Bücher | Advances in Electronic Testing: Challenges and Methodologies is a new type of edited volume in the Frontiers in Electronic Testing book series devoted to recent advances in electronic circuits testing. The book is a comprehensive elaboration on important topics which capture major research and development efforts today. The motivation and inspiration behind this book is to deliver a thorough text that focuses on the evolution of test technology, provides insight about the abiding importance of discussed topics, records today¿s state of the art and industrial practices and trends, reveals the challenges for emerging testing methodologies, and envisages the future of this journey. The book consists of eleven edited chapters written by experts in Defect-Oriented Testing, Nanometer Technologies Failures and Testing, Silicon Debug, Delay Testing, High-Speed Test Interfaces, DFT-Oriented Low-Cost Testers, Embedded Cores and System-on-Chip Testing, Memory Testing, Mixed-Signal Testing, RF Testing and Loaded Board Testing. Contributing authors are affiliated with (in alphabetical order) Agilent, ARM, Balearic Islands Univ., IBM, Inovys, Intel, LogicVision, Magma, Mentor Graphics, New Mexico Univ., Sandia National Labs, Synopsys, Teradyne and Texas Instruments. Advances in Electronic Testing: Challenges and Methodologies is an advanced textbook and reference point for senior undergraduate and graduate students in MSc or PhD tracks, professors and research leaders in the electronic testing domain. It is also for industry design and test engineers and managers seeking a global view and understanding of test technology practices and methodologies and a dense elaboration on test-related issues they face in their development projects. "There is a definite need for documenting the advances in testing ¿ I find the work of this edited volume by Dimitris Gizopoulos and his team of authors to be significant and timely. [¿] the book provides, besidesnovel test methodologies, a collective insight into the emerging aspects of testing. This, I think, is beneficial to practicing engineers and researchers both of whom must stay at the forefront of technology. [¿] This latest addition to the Frontiers Series is destined to serve an important role." From the Foreword by Vishwani D. Agrawal, Consulting Editor, Frontiers in Electronic Testing Book Series.
Lingua: Inglese
Editore: Springer International Publishing, 2018
ISBN 10: 3319853910 ISBN 13: 9783319853918
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 106,99
Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides comprehensive coverage of the dependability challenges in today's advanced computing systems. It is an in-depth discussion of all the technological and design-level techniques that may be used to overcome these issues and analyzes various dependability-assessment methods. The impact of individual application scenarios on the definition of challenges and solutions is considered so that the designer can clearly assess the problems and adjust the solution based on the specifications in question. The book is composed of three sections, beginning with an introduction to current dependability challenges arising in complex computing systems implemented with nanoscale technologies, and of the effect of the application scenario. The second section details all the fault-tolerance techniques that are applicable in the manufacture of reliable advanced computing devices. Different levels, from technology-level fault avoidance to the use of error correcting codes and system-level checkpointing are introduced and explained as applicable to the different application scenario requirements. Finally the third section proposes a roadmap of future trends in and perspectives on the dependability and manufacturability of advanced computing systems from the special point of view of industrial stakeholders. Dependable Multicore Architectures at Nanoscale showcases the original ideas and concepts introduced into the field of nanoscale manufacturing and systems reliability over nearly four years of work within COST Action IC1103 MEDIAN, a think-tank with participants from 27 countries. Academic researchers and graduate students working in multi-core computer systems and their manufacture will find this book of interest as will industrial design and manufacturing engineers working in VLSI companies.
Lingua: Inglese
Editore: Springer International Publishing, 2017
ISBN 10: 3319544217 ISBN 13: 9783319544212
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 106,99
Quantità: 1 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides comprehensive coverage of the dependability challenges in today's advanced computing systems. It is an in-depth discussion of all the technological and design-level techniques that may be used to overcome these issues and analyzes various dependability-assessment methods. The impact of individual application scenarios on the definition of challenges and solutions is considered so that the designer can clearly assess the problems and adjust the solution based on the specifications in question. The book is composed of three sections, beginning with an introduction to current dependability challenges arising in complex computing systems implemented with nanoscale technologies, and of the effect of the application scenario. The second section details all the fault-tolerance techniques that are applicable in the manufacture of reliable advanced computing devices. Different levels, from technology-level fault avoidance to the use of error correcting codes and system-level checkpointing are introduced and explained as applicable to the different application scenario requirements. Finally the third section proposes a roadmap of future trends in and perspectives on the dependability and manufacturability of advanced computing systems from the special point of view of industrial stakeholders. Dependable Multicore Architectures at Nanoscale showcases the original ideas and concepts introduced into the field of nanoscale manufacturing and systems reliability over nearly four years of work within COST Action IC1103 MEDIAN, a think-tank with participants from 27 countries. Academic researchers and graduate students working in multi-core computer systems and their manufacture will find this book of interest as will industrial design and manufacturing engineers working in VLSI companies.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 162,50
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 162,50
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
Lingua: Inglese
Editore: Institution of Engineering and Technology, GB, 2020
ISBN 10: 1785617974 ISBN 13: 9781785617973
Da: Rarewaves USA United, OSWEGO, IL, U.S.A.
EUR 140,09
Quantità: Più di 20 disponibili
Aggiungi al carrelloHardback. Condizione: New. Reliability has always been a major concern in designing computing systems. However, the increasing complexity of such systems has led to a situation where efforts for assuring reliability have become extremely costly, both for the design of solutions for the mitigation of possible faults, and for the reliability assessment of such techniques. Cross-layer reliability is fast becoming the preferred solution. In a cross-layer resilient system, physical and circuit level techniques can mitigate low-level faults. Hardware redundancy can be used to manage errors at the hardware architecture layer. Eventually, software implemented error detection and correction mechanisms can manage those errors that escaped the lower layers of the stack. This book presents state-of-the-art solutions for increasing the resilience of computing systems, both at single levels of abstraction and multi-layers. The book begins by addressing design techniques to improve the resilience of computing systems, covering the logic layer, the architectural layer and the software layer. The second part of the book focuses on cross-layer resilience, including coverage of physical stress, reliability assessment approaches, fault injection at the ISA level, analytical modelling for cross-later resiliency, and stochastic methods. Cross-Layer Reliability of Computing Systems is a valuable resource for researchers, postgraduate students and professional computer architects focusing on the dependability of computing systems.
Lingua: Inglese
Editore: Inst of Engineering & Technology, 2020
ISBN 10: 1785617974 ISBN 13: 9781785617973
Da: Revaluation Books, Exeter, Regno Unito
EUR 171,91
Quantità: 2 disponibili
Aggiungi al carrelloHardcover. Condizione: Brand New. 300 pages. 9.25x6.25x0.75 inches. In Stock.
EUR 163,94
Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. pp. 236.