Ju sungtaek (20 risultati)
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Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Advances in the semiconductor technology have enabled steady, exponential im provement in the performance of integrated circuits. Miniaturization allows the integration of a larger number of transistors with enhanced switching speed. Novel transis…tor structures and passivation materials diminish circuit delay by minimizing parasitic electrical capacitance. These advances, however, pose several challenges for the thermal engineering of integrated circuits. The low thermal conductivities of passivation layers result in large temperature rises and temperature gradient magni tudes, which degrade electrical characteristics of transistors and reduce lifetimes of interconnects. As dimensions of transistors and interconnects decrease, the result ing changes in current density and thermal capacitance make these elements more susceptible to failure during brief electrical overstress. This work develops a set of high-resolution measurement techniques which de termine temperature fields in transistors and interconnects, as well as the thermal properties of their constituent films. At the heart of these techniques is the thermore flectance thermometry method, which is based on the temperature dependence of the reflectance of metals. Spatial resolution near 300 nm and temporal resolution near IOns are demonstrated by capturing transient temperature distributions in intercon nects and silicon-on-insulator (SOl) high-voltage transistors. Analyses of transient temperature data obtained from interconnect structures yield thermal conductivities and volumetric heat capacities of thin films.
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Taschenbuch. Condizione: Neu. Microscale Heat Conduction in Integrated Circuits and Their Constituent Films | Y. Sungtaek Ju (u. a.) | Taschenbuch | Microsystems | xxi | Englisch | 2012 | Springer | EAN 9781461373742 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartm…ann[at]springer[dot]com | Anbieter: preigu.
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Condizione: New. pp. 132.
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Condizione: New. Discusses experimental and theoretical studies of heat transfer in transistors and interconnects. This book reports techniques for determining the thermal transport properties of dielectric passivation layers and ultra-thin silicon-on-insulator (SOI) layers. Series: Microsystems. Num Pages: 123 pages, biography.… BIC Classification: TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 9. Weight in Grams: 810. . 1999. Hardback. . . . .
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Condizione: New. Discusses experimental and theoretical studies of heat transfer in transistors and interconnects. This book reports techniques for determining the thermal transport properties of dielectric passivation layers and ultra-thin silicon-on-insulator (SOI) layers. Series: Microsystems. Num Pages: 123 pages, biography.… BIC Classification: TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 9. Weight in Grams: 810. . 1999. Hardback. . . . . Books ship from the US and Ireland.
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Da: Buchpark, Trebbin, GermaniaBuchpark
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Condizione: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | Advances in the semiconductor technology have enabled steady, exponential im provement in the performance of integrated circuits. Miniaturization allows the integration of a larger number of transistors with enhanced switching speed. Novel transi…stor structures and passivation materials diminish circuit delay by minimizing parasitic electrical capacitance. These advances, however, pose several challenges for the thermal engineering of integrated circuits. The low thermal conductivities of passivation layers result in large temperature rises and temperature gradient magni tudes, which degrade electrical characteristics of transistors and reduce lifetimes of interconnects. As dimensions of transistors and interconnects decrease, the result ing changes in current density and thermal capacitance make these elements more susceptible to failure during brief electrical overstress. This work develops a set of high-resolution measurement techniques which de termine temperature fields in transistors and interconnects, as well as the thermal properties of their constituent films. At the heart of these techniques is the thermore flectance thermometry method, which is based on the temperature dependence of the reflectance of metals. Spatial resolution near 300 nm and temporal resolution near IOns are demonstrated by capturing transient temperature distributions in intercon nects and silicon-on-insulator (SOl) high-voltage transistors. Analyses of transient temperature data obtained from interconnect structures yield thermal conductivities and volumetric heat capacities of thin films.
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Gebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Preface. Foreword. Acknowledgements. Nomenclature. 1. Introduction. 2. Review of Microscale Thermometry Techniques. 3. High Spatial and Temporal Resolution Thermometry. 4. Thermal Properties of Amorphous Di…electric Films. 5. Heat Conduction in Crystalli.
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Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Preface. Foreword. Acknowledgements. Nomenclature. 1. Introduction. 2. Review of Microscale Thermometry Techniques. 3. High Spatial and Temporal Resolution Thermometry. 4. Thermal Properties of Amorphous Dielectric F…ilms. 5. Heat Conduction in Crystalli.
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Condizione: New. Print on Demand pp. 132 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
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Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
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Condizione: New. PRINT ON DEMAND pp. 132.
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Da: preigu, Osnabrück, Germaniapreigu
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Buch. Condizione: Neu. Microscale Heat Conduction in Integrated Circuits and Their Constituent Films | Y. Sungtaek Ju (u. a.) | Buch | Microsystems | xxi | Englisch | 1999 | Springer | EAN 9780792385912 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springe…r[dot]com | Anbieter: preigu Print on Demand.
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Buch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Advances in the semiconductor technology have enabled steady, exponential im provement in the performance of integrated circuits. Miniaturization allows the integration of a larger number of transistors with enhanced switching speed. Novel tr…ansistor structures and passivation materials diminish circuit delay by minimizing parasitic electrical capacitance. These advances, however, pose several challenges for the thermal engineering of integrated circuits. The low thermal conductivities of passivation layers result in large temperature rises and temperature gradient magni tudes, which degrade electrical characteristics of transistors and reduce lifetimes of interconnects. As dimensions of transistors and interconnects decrease, the result ing changes in current density and thermal capacitance make these elements more susceptible to failure during brief electrical overstress. This work develops a set of high-resolution measurement techniques which de termine temperature fields in transistors and interconnects, as well as the thermal properties of their constituent films. At the heart of these techniques is the thermore flectance thermometry method, which is based on the temperature dependence of the reflectance of metals. Spatial resolution near 300 nm and temporal resolution near IOns are demonstrated by capturing transient temperature distributions in intercon nects and silicon-on-insulator (SOl) high-voltage transistors. Analyses of transient temperature data obtained from interconnect structures yield thermal conductivities and volumetric heat capacities of thin films.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 132 pp. Englisch.
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
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Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -1 Introduction.- 1.1 Thermal Issues in Integrated Circuit Elements.- 1.2 Scope of Research.- 1.3 Book Overview.- 2 Review of Microscale Thermometry Techniques.- 2.1 Electrical Methods.- 2.2 Optical Methods.- 3 High Spatial and Temporal… Resolution Thermometry.- 3.1 Thermoreflectance Thermometry Technique.- 3.2 Thermal Characterization of Silicon-on-Insulator High-Voltage Transistors.- 3.3 Thermal Characterization of Interconnects.- 4 Thermal Properties of Amorphous Dielectric Films.- 4.1 Thermal Characterization Techniques for Dielectric Films.- 4.2 Heat Transport in Amorphous Silicon Dioxide.- 5 Heat Conduction in Crystalline Silicon Films.- 5.1 Phonon Dispersion and its Implication on the Estimation of the Phonon Mean Free Path.- 5.2 Measurements of In-Plane Thermal Conductivities of Silicon Films.- 5.3 Heat Conduction in Semiconductors at High Temperatures.- 5.4 Prediction of the In-Plane Thermal Conductivity of Silicon Thin Films.- 5.5 Simplified Phonon Transport Equations Accounting for Phonon Dispersion.- 5.6 Hot Phonon Effects.- 6 Summary and Recommendations.- 6.1 Atomistic Simulations of Heat Transport.- 6.2 Thermal Conductivities of Nanostructures.- 6.3 Detailed Simulations of Semiconductor Device.- A Uncertainty Analysis.- A.1 Uncertainly in the Temperature Rise.- A.2 Uncertainly in the Thermal Properties of Dielectric Films.- A.3 Uncertainly in the In-Plane Thermal Conductivity of Thin Films.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 128 pp. Englisch.
