Li yan goyal deepak (37 risultati)
Lingua: Inglese
Editore: Springer, 2017
Serie: Libro 61 di 72 - Springer Series in Advanced Microelectronics
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Da: Homeless Books, Berlin, GermaniaHomeless Books
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Hardcover. Condizione: Sehr gut. 1. Auflage. Unread book in excellent condition. Language - English. Ships from Berlin. - This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging,…an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
Lingua: Inglese
Editore: Springer, 2020
Serie: Libro 66 di 72 - Springer Series in Advanced Microelectronics
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Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
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Condizione: New. In.
Lingua: Inglese
Editore: Springer, 2020
Serie: Libro 66 di 72 - Springer Series in Advanced Microelectronics
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Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Condizione: New.
Lingua: Inglese
Editore: Springer, 2020
Serie: Libro 66 di 72 - Springer Series in Advanced Microelectronics
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Condizione: New.
Lingua: Inglese
Editore: Springer, 2018
Serie: Libro 61 di 72 - Springer Series in Advanced Microelectronics
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Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
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Condizione: New. In.
Lingua: Inglese
Editore: Springer, 2020
Serie: Libro 66 di 72 - Springer Series in Advanced Microelectronics
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Da: California Books, Miami, FL, U.S.A.California Books
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Condizione: New.
Lingua: Inglese
Editore: Springer, 2020
Serie: Libro 66 di 72 - Springer Series in Advanced Microelectronics
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Condizione: As New. Unread book in perfect condition.
Lingua: Inglese
Editore: Springer, 2020
Serie: Libro 66 di 72 - Springer Series in Advanced Microelectronics
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Da: GreatBookPricesUK, Woodford Green, Regno UnitoGreatBookPricesUK
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Condizione: As New. Unread book in perfect condition.
Lingua: Inglese
Editore: Springer, 2021
Serie: Libro 66 di 72 - Springer Series in Advanced Microelectronics
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Da: preigu, Osnabrück, Germaniapreigu
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Taschenbuch. Condizione: Neu. 3D Microelectronic Packaging | From Architectures to Applications | Yan Li (u. a.) | Taschenbuch | Springer Series in Advanced Microelectronics | xvii | Englisch | 2021 | Springer | EAN 9789811570926 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juer…gen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Lingua: Inglese
Editore: Springer Verlag, Singapore, SG, 2020
Serie: Libro 66 di 72 - Springer Series in Advanced Microelectronics
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Da: Rarewaves.com USA, London, LONDO, Regno UnitoRarewaves.com USA
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Hardback. Condizione: New. Second Edition 2021. This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of th…e latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Lingua: Inglese
Editore: Springer, 2021
Serie: Libro 66 di 72 - Springer Series in Advanced Microelectronics
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condizione: New. 2nd ed. 2021 edition NO-PA16APR2015-KAP.
Lingua: Inglese
Editore: Springer, 2020
Serie: Libro 66 di 72 - Springer Series in Advanced Microelectronics
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condizione: New.
Lingua: Inglese
Editore: Springer, 2021
Serie: Libro 66 di 72 - Springer Series in Advanced Microelectronics
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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EUR 192,59
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Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides read…ers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Lingua: Inglese
Editore: Springer, 2018
Serie: Libro 61 di 72 - Springer Series in Advanced Microelectronics
- Brossura
Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelect…ronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
Lingua: Inglese
Editore: Springer, Springer, 2020
Serie: Libro 66 di 72 - Springer Series in Advanced Microelectronics
- Rilegato
Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an…in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Lingua: Inglese
Editore: Springer, 2018
Serie: Libro 61 di 72 - Springer Series in Advanced Microelectronics
- Brossura
Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condizione: New. Softcover reprint of the original 1st ed. 2017 edition NO-PA16APR2015-KAP.
Lingua: Inglese
Editore: Springer Nature, 2021
Serie: Libro 66 di 72 - Springer Series in Advanced Microelectronics
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Da: Revaluation Books, Exeter, Regno UnitoRevaluation Books
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Hardcover. Condizione: Brand New. 2nd edition. 639 pages. 9.25x6.10x1.50 inches. In Stock.
Lingua: Inglese
Editore: Springer Verlag, Singapore, SG, 2020
Serie: Libro 66 di 72 - Springer Series in Advanced Microelectronics
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Da: Rarewaves.com UK, London, Regno UnitoRarewaves.com UK
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Hardback. Condizione: New. Second Edition 2021. This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of th…e latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Lingua: Inglese
Editore: Springer, 2018
Serie: Libro 61 di 72 - Springer Series in Advanced Microelectronics
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Da: Mispah books, Redhill, SURRE, Regno UnitoMispah books
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Paperback. Condizione: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Lingua: Inglese
Editore: Springer, 2020
Serie: Libro 66 di 72 - Springer Series in Advanced Microelectronics
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Hardcover. Condizione: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Lingua: Inglese
Editore: Springer, 2020
Serie: Libro 66 di 72 - Springer Series in Advanced Microelectronics
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Condizione: new. Questo è un articolo print on demand.
Lingua: Inglese
Editore: Springer, 2021
Serie: Libro 66 di 72 - Springer Series in Advanced Microelectronics
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Condizione: new. Questo è un articolo print on demand.
Lingua: Inglese
Editore: Springer, 2018
Serie: Libro 61 di 72 - Springer Series in Advanced Microelectronics
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PAP. Condizione: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
Lingua: Inglese
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Serie: Libro 61 di 72 - Springer Series in Advanced Microelectronics
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PAP. Condizione: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
Lingua: Inglese
Editore: Springer, Berlin|Springer Nature Singapore|Springer, 2021
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Da: moluna, Greven, Germaniamoluna
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Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectro…nic packaging.This book off.
Lingua: Inglese
Editore: Springer Singapore, 2020
Serie: Libro 66 di 72 - Springer Series in Advanced Microelectronics
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Da: moluna, Greven, Germaniamoluna
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Gebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides comprehensive coverage of 3D microelectronic packages Explains the fundamentals of using solder interconnects as micro-bumps Demonstrates the advanced materials and processes used in 3D microelectr…onic packages Introd.
Lingua: Inglese
Editore: Springer, Springer Nov 2021, 2021
Serie: Libro 66 di 72 - Springer Series in Advanced Microelectronics
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.…It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development. 640 pp. Englisch.
Lingua: Inglese
Editore: Springer, Springer Nov 2020, 2020
Serie: Libro 66 di 72 - Springer Series in Advanced Microelectronics
- Rilegato
- Print on Demand
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It prov…ides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development. 640 pp. Englisch.
Lingua: Inglese
Editore: Springer International Publishing Jul 2018, 2018
Serie: Libro 61 di 72 - Springer Series in Advanced Microelectronics
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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EUR 192,59
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Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for f…uture microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. 476 pp. Englisch.
Lingua: Inglese
Editore: Springer, Springer Nov 2021, 2021
Serie: Libro 66 di 72 - Springer Series in Advanced Microelectronics
- Brossura
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
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Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It p…rovides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 640 pp. Englisch.
