Nicolas posseme (2 risultati)

Autore: 
Perfeziona con la Ricerca avanzata

Perfeziona la tua ricerca

  • Libri (2)

  • Nuovo (2)

  • Con foto (2)

a

Fascia di prezzo personalizzata (EUR)

a

  • Lingua: Inglese

    Editore: ISTE Press - Elsevier, 2017

    1785480960 / 9781785480966

    • Rilegato
    • Print on Demand

    Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.

    Venditore con 5 stelle
    Contatta il venditore

    Condizione: Nuovo

    EUR 57,95

    EUR 23,00 spedizione 
    Spedito da Germania a U.S.A.

    Quantità: 2 disponibili

    Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Plasma etching has long enabled the perpetuation of Moore's Law. Today, etch compensation helps to create devices that are smaller than 20 nm. But, with the constant downscaling in device dimensions and the emergence of complex 3D structures (like FinFet, Nanowire and stacked nanowire at longer term) and sub 20 nm devices, plasma etching requirements have become more and more stringent.Now more than ever, plasma etch technology is used to push the limits of semiconductor device fabrication into the nanoelectronics age. This will require improvement in plasma technology (plasma sources, chamber design, etc.), new chemistries (etch gases, flows, interactions with substrates, etc.) as well as a compatibility with new patterning techniques such as multiple patterning, EUV lithography, Direct Self Assembly, ebeam lithography or nanoimprint lithography.This book presents these etch challenges and associated solutions encountered throughout the years for transistor realization. Englisch.…

  • Lingua: Inglese

    Editore: ISTE Press - Elsevier, 2017

    1785480960 / 9781785480966

    • Rilegato
    • Print on Demand

    Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH

    Venditore con 5 stelle
    Contatta il venditore

    Condizione: Nuovo

    EUR 83,20

    EUR 35,00 spedizione 
    Spedito da Germania a U.S.A.

    Quantità: 2 disponibili

    Buch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Plasma etching has long enabled the perpetuation of Moore's Law. Today, etch compensation helps to create devices that are smaller than 20 nm. But, with the constant downscaling in device dimensions and the emergence of complex 3D structures (like FinFet, Nanowire and stacked nanowire at longer term) and sub 20 nm devices, plasma etching requirements have become more and more stringent.Now more than ever, plasma etch technology is used to push the limits of semiconductor device fabrication into the nanoelectronics age. This will require improvement in plasma technology (plasma sources, chamber design, etc.), new chemistries (etch gases, flows, interactions with substrates, etc.) as well as a compatibility with new patterning techniques such as multiple patterning, EUV lithography, Direct Self Assembly, ebeam lithography or nanoimprint lithography.This book presents these etch challenges and associated solutions encountered throughout the years for transistor realization.…