Editore: Greenleaf Publishing Company, 1953
Da: Preferred Books, Rancho Cucamonga, CA, U.S.A.
Soft cover. Condizione: Near Fine. Very little wear. Nice color. Tanned page ends. Published in Evanston, IL by Greenleaf Publishing Company. 1953. First Edition. Magazine. Digest-sized pictorial wrappers [about 5.5" x 7.25"], 162 pages, illustrated. Includes "Sky Lift" by Robert A. Heinlein, "The Time Armada" by Fox B. Holden, "Guaranteed---Forever!" by Frank M. Robinson, "The Music Master" by F. L. Wallace, etc.
Editore: Greenleaf Publishing Company, Evanston, 1953
Da: biblioboy, North Providence, RI, U.S.A.
Prima edizione
SingleIssueMagazine. Condizione: Good. First Edition. IMAGINATION: STORIES OF SCIENCE AND FANTASY SEPTEMBER 1953 VOLUME 4 NUMBER 8. Published in Evanston, IL by Greenleaf Publishing Company. 1953. First Edition. Magazine. Digest-sized pictorial wrappers [about 5.5" x 7.25"], 162 pages, illustrated. Includes "Sky Lift" by Robert A. Heinlein, "The Time Armada" by Fox B. Holden, "Guaranteed---Forever!" by Frank M. Robinson, "The Music Master" by F. L. Wallace, etc. Condition: Good or better copy with shallow tearing to the spine ends with a small chip to the heel rear corner, shallow edge tearing and some creasing to the front cover, text paper tanned. See photos pulp 1.
EUR 5,76
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has soft covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,200grams, ISBN:
Lingua: Inglese
ISBN 10: 7515921641 ISBN 13: 9787515921648
Da: liu xing, Nanjing, JS, Cina
EUR 143,39
Quantità: 3 disponibili
Aggiungi al carrelloHardcover. Condizione: New. HardCover.Pub Date:2022-10 Pages:369 Language:ChinesePublisher:China Aerospace PressSelf-operated3D Integration Handbook Volume 3 Three-Dimensional Process Technologyis divided into 22 chapters. namely: 3D IC integration since 2008. main applications and market trends of 3D integration and interposer technology. economic drivers and barriers to 2.5D/3D integration. interposer technology. TSV manufacturing overview. TSV unit process and integration. TSV preparation of ASET. laser-assisted wafe.