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  • Lingua: Inglese

    Editore: McGraw-Hill Professional

    0639785322092

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    Da: Hamelyn, Madrid, M, SpagnaHamelyn

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    Condizione: Good. : Este libro técnico proporciona una guía exhaustiva sobre las tecnologías de microvías y WLCSP, fundamentales para el diseño y la fabricación de sistemas de interconexión de alta densidad y bajo costo. A través de sus páginas, los autores John H. Lau y S.W. Ricky Lee exploran métodos para crear sistemas electrónicos más eficientes y fiables, incluyendo más de 500 ilustraciones detalladas y fotografías que facilitan la comprensión de procesos complejos como la perforación láser y mecánica en placas de circuito impreso.Dirigido a profesionales y académicos del área de la ingeniería electrónica y de telecomunicaciones, el texto aborda temas críticos como los materiales electrónicos, el control de costes en la construcción de circuitos integrados y las tecnologías de empaquetado microelectrónico. Es una referencia esencial para aquellos interesados en las últimas innovaciones en hardware y componentes de circuitos. EAN: 0639785322092 Tipo: Libros Categoría: Tecnología Título: Microvias: For Low Cost, High Density Interconnects Autor: John H. Lau| S.W. Ricky Lee Editorial: McGraw-Hill Professional Idioma: en Páginas: 565 Formato: tapa dura.…

  • Lingua: Inglese

    Editore: McGraw-Hill

    0639785306085

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    Da: Hamelyn, Madrid, M, SpagnaHamelyn

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    Condizione: Usato - Molto buono

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    Condizione: Very Good. : Este libro técnico es una guía exhaustiva sobre el diseño, materiales, procesos, fiabilidad y aplicaciones de los paquetes a escala de chip (CSP). Escrito por los expertos John H. Lau y Ricky S. W. Lee, la obra profundiza en las innovaciones tecnológicas necesarias para la miniaturización de componentes electrónicos.Es un recurso esencial para ingenieros y profesionales del sector de semiconductores, proporcionando un análisis detallado de los desafíos de fabricación y las soluciones de ingeniería en el empaquetado de circuitos integrados modernos. EAN: 0639785306085 Tipo: Libros Categoría: Tecnología|Ciencias Título: Chip scale package Autor: John H. Lau| Ricky S. W. Lee Editorial: McGraw-Hill Idioma: en Páginas: 500 Formato: tapa dura.…

  • Lingua: Inglese

    Editore: McGraw-Hill Professional, 2001

    0071363270 / 9780071363273

    Serie: Libro 8 di 31 - McGraw-Hill Professional Engineering

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    Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

  • Lingua: Inglese

    Editore: McGraw-Hill Professional, New York

    0071363270 / 9780071363273

    Serie: Libro 8 di 31 - McGraw-Hill Professional Engineering

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    Hardcover. Condizione: New. No Jacket. First Edition. Brand New! The covers look great. The binding is tight. The interior pages are clean and unmarked. Electronic delivery tracking will be issued free of charge.

  • Lingua: Inglese

    Editore: Wiley, 2021

    1118881478 / 9781118881477

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  • Lingua: Inglese

    Editore: John Wiley & Sons Inc, New York, 2021

    1118881478 / 9781118881477

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    Hardcover. Condizione: new. Hardcover. FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. Theyll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chipsPractical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterizationComprehensive explorations of board-level assembly and LED modules and optical and electrical characterizationIn-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

  • Lingua: Inglese

    Editore: Wiley, 2021

    1118881478 / 9781118881477

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    Editore: John Wiley & Sons, 2021

    1118881478 / 9781118881477

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  • Lingua: Inglese

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    1118881478 / 9781118881477

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  • Lingua: Inglese

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    1118881478 / 9781118881477

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  • Lingua: Inglese

    Editore: John Wiley and Sons Inc, US, 2021

    1118881478 / 9781118881477

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    Hardback. Condizione: New. FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They'll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chipsPractical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterizationComprehensive explorations of board-level assembly and LED modules and optical and electrical characterizationIn-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.…

  • Lingua: Inglese

    Editore: Wiley, 2021

    1118881478 / 9781118881477

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  • Lingua: Inglese

    Editore: John Wiley & Sons Inc, New York, 2021

    1118881478 / 9781118881477

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    Hardcover. Condizione: new. Hardcover. FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. Theyll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chipsPractical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterizationComprehensive explorations of board-level assembly and LED modules and optical and electrical characterizationIn-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…

  • Lingua: Inglese

    Editore: Wiley, 2021

    1118881478 / 9781118881477

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  • Lingua: Inglese

    Editore: John Wiley & Sons Inc, New York, 2021

    1118881478 / 9781118881477

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    Hardcover. Condizione: new. Hardcover. FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. Theyll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chipsPractical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterizationComprehensive explorations of board-level assembly and LED modules and optical and electrical characterizationIn-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.…

  • Lingua: Inglese

    Editore: Wiley 2017-02-01, 2017

    1118881478 / 9781118881477

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    Editore: Wiley, 2021

    1118881478 / 9781118881477

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    Condizione: New. In English.

  • Lingua: Inglese

    Editore: John Wiley & Sons Inc, 2021

    1118881478 / 9781118881477

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  • Lingua: Inglese

    Editore: John Wiley & Sons Inc, 2021

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    Condizione: New. Num Pages: 352 pages. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 250 x 150 x 15. Weight in Grams: 666. . 2021. 1st Edition. Hardcover. . . . .

  • Lingua: Inglese

    Editore: Wiley, 2021

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    Hardcover. Condizione: Brand New. 320 pages. 8.60x6.08x0.88 inches. In Stock.

  • Lingua: Inglese

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    1118881478 / 9781118881477

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    Condizione: New. Num Pages: 352 pages. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 250 x 150 x 15. Weight in Grams: 666. . 2021. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.

  • Lingua: Inglese

    Editore: John Wiley and Sons Inc, US, 2021

    1118881478 / 9781118881477

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    Hardback. Condizione: New. FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They'll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chipsPractical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterizationComprehensive explorations of board-level assembly and LED modules and optical and electrical characterizationIn-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.…

  • Lingua: Inglese

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    1118881478 / 9781118881477

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    Buch. Condizione: Neu. Neuware - FROM LED TO SOLID STATE LIGHTINGA comprehensive and practical reference complete with hands-on exercises and experimental dataIn From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features.Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They'll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material.This important book also includes:\* Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips\* Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization\* Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization\* In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lightingPerfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.…

  • Lingua: Inglese

    Editore: Wiley, 2021

    1118881478 / 9781118881477

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    Hardcover. Condizione: New. HardCover.Pub Date:2021-12-01 Pages:247 Language:English Publisher:Chemical Industry PressThe main advantages of solid-state lighting are energy saving. environmental friendliness and long life. and LED (Light Emitting Diode) packaging is the main guarantee for obtaining these advantages technology. This book not only covers the basic principles of lighting. colorimetry. photometry. light-emitting diodes. but also provides a comprehensive introduction to LED wafer and chip manufacturing. LED .…

  • Lingua: Inglese

    Editore: John Wiley & Sons Inc, 2021

    1118881478 / 9781118881477

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    Hardback. Condizione: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 726.

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    Hardcover. Condizione: Brand New. 320 pages. 8.60x6.08x0.88 inches. In Stock. This item is printed on demand.

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