John h lau (245 risultati)

Hardcover. Condizione: Very Good. Sorry, No international shipping on this item.Ex-Library hardcover in very nice condition with the usual markings and attachments. Except for library markings, interior clean and unmarked. Tight binding.

hardcover. Condizione: Good. Satisfaction 100% guaranteed.

Condizione: Very Good. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Condizione: Very Good. : Este libro técnico es una guía exhaustiva sobre el diseño, materiales, procesos, fiabilidad y aplicaciones de los paquetes a escala de chip (CSP). Escrito por los expertos John H. Lau y Ricky S. W. Lee, la obra profundiza en las innovaciones tecnológicas necesarias para la miniaturización de componentes electrónicos.Es un recurso esencial para ingenieros y profesionales del sector de semiconductores, proporcionando un análisis detallado de los desafíos de fabricación y las soluciones de ingeniería en el empaquetado de circuitos integrados modernos. EAN: 0639785306085 Tipo: Libros Categoría: Tecnología|Ciencias Título: Chip scale package Autor: John H. Lau| Ricky S. W. Lee Editorial: McGraw-Hill Idioma: en Páginas: 500 Formato: tapa dura.…

Condizione: very good. Gently used. May include previous owner's signature or bookplate on the front endpaper, sticker on back and/or remainder mark on text block.

hardcover. Condizione: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.

Hardcover. Condizione: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Condizione: good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Good condition! Any other included accessories are also in Good condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear.

Condizione: very_good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in very good condition! The cover and any other included accessories are also in very good condition showing some minor use. The spine is straight, there are no rips tears or creases on the cover or the pages.…

hardcover. Condizione: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.

Condizione: good. Signs of wear and consistent use.

Hardcover. Condizione: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Hardcover. Condizione: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Condizione: Very Good. 1st Edition. Former library copy. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.…

hardcover. Condizione: New.

Condizione: like_new.

Condizione: good. USED book in GOOD condition. Great binding, pages and cover show normal signs of wear from use.

Condizione: good. A copy that has been read, remains in good condition. All pages are intact, and the cover is intact. The spine and cover show signs of wear. Pages can include notes and highlighting and show signs of wear, and the copy can include "From the library of" labels or previous owner inscriptions. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item! Ships via media mail.…

Condizione: like_new. Fast Free Shipping â" Excellent condition book with clean cover and pages. Barely handled, with minimal wear. An outstanding copy, close to enjoy.

Hardcover. Condizione: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.

Condizione: good. Book shows wear from use but remains a usable copy. May include writing highlighting underlining library markings. LISTING USES STOCK PHOTOS AND COVER MAY VARY. Ships via USPS and typically arrives within 10-12 business days.

hardcover. Condizione: Acceptable. Highlighting/Underlining/Notes etc. Satisfaction 100% guaranteed.

Condizione: good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Good condition! Any other included accessories are also in Good condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear.

Condizione: New.

Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condizione: Good. : Este libro técnico proporciona una guía exhaustiva sobre las tecnologías de microvías y WLCSP, fundamentales para el diseño y la fabricación de sistemas de interconexión de alta densidad y bajo costo. A través de sus páginas, los autores John H. Lau y S.W. Ricky Lee exploran métodos para crear sistemas electrónicos más eficientes y fiables, incluyendo más de 500 ilustraciones detalladas y fotografías que facilitan la comprensión de procesos complejos como la perforación láser y mecánica en placas de circuito impreso.Dirigido a profesionales y académicos del área de la ingeniería electrónica y de telecomunicaciones, el texto aborda temas críticos como los materiales electrónicos, el control de costes en la construcción de circuitos integrados y las tecnologías de empaquetado microelectrónico. Es una referencia esencial para aquellos interesados en las últimas innovaciones en hardware y componentes de circuitos. EAN: 0639785322092 Tipo: Libros Categoría: Tecnología Título: Microvias: For Low Cost, High Density Interconnects Autor: John H. Lau| S.W. Ricky Lee Editorial: McGraw-Hill Professional Idioma: en Páginas: 565 Formato: tapa dura.…

paperback. Condizione: Very Good.

Hardcover. Condizione: New. No Jacket. First Edition. Brand New! The covers look great. The binding is tight. The interior pages are clean and unmarked. Electronic delivery tracking will be issued free of charge.

Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.