Suresh sitaraman (20 risultati)

Condizione: New.

Condizione: As New. Unread book in perfect condition.

Condizione: New. In English.

Condizione: New.

Condizione: New.

Condizione: New. In English.

Condizione: As New. Unread book in perfect condition.

Condizione: New. pp. 212.

Hardcover. Condizione: Brand New. 1st edition. 192 pages. 9.25x6.00x0.50 inches. In Stock.

Condizione: New. pp. 210.

Paperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condizione: As New. Unread book in perfect condition.

Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Solder Joint Reliability Prediction for Multiple Environmentswill provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space,and automotive industries. 212 pp. Englisch.…

Gebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a comprehensive summary of current literature on lead-containing ceramic area array electronic package solder joining reliabilityDevelops useful and easy-to-use tools for predicting solder joint fatigue life under thermal cycling and powe.…

Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Solder Joint Reliability Prediction for Multiple Environmentswill provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space,and automotive industries. 208 pp. Englisch.…

Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a comprehensive summary of current literature on lead-containing ceramic area array electronic package solder joining reliabilityDevelops useful and easy-to-use tools for predicting solder joint fatigue life under thermal cycling and powe.…

Condizione: New. Print on Demand pp. 212 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.

Condizione: New. PRINT ON DEMAND pp. 212.

Condizione: New. Print on Demand pp. 210 70 Illus.

Condizione: New. PRINT ON DEMAND pp. 210.