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hardcover. Condizione: Very Good. Connecting readers with great books since 1972! Used books may not include companion materials, and may have some shelf wear or limited writing. We ship orders daily and Customer Service is our top priority.

Hardcover. Condizione: Good. No Jacket. Missing dust jacket; Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.

Condizione: Very Good. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Condizione: Good. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Condizione: Good. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Hardcover. Condizione: Very Good. Condizione sovraccoperta: Good. 1st Edition. Binding tight. 2nd impression. 1943. Text block has no marks or writing. No shelf wear to boards. Dust jacket is in a protective mylar sleeve and shows shelf wear and chips to top and bottom of spine. Photo is actual book. Satisfaction guaranteed. Selling quality books online for 30 years. Ships in 24 hours.…

Condizione: Very Good. 1943. Hardcover. Very good clean copy in original cloth covers. Title in tilt to spine. Small nick on the spine. Ex-Libris with stamps on ffep, remains very good. . . . . Books ship from the US and Ireland.

Condizione: Very Good. 1943. Hardcover. Very good clean copy in original cloth covers. Title in tilt to spine. Small nick on the spine. Ex-Libris with stamps on ffep, remains very good. . . . .

No Jacket. FIRST EDITION, octavo hardcover (VG-, lacks d/w); all our specials have minimal description to keep listing them viable. They are at least reading copies, complete and in reasonable condition, but usually secondhand; frequently, they are superior examples. Ordering more than one book may reduce your overall postage costs.…

6th imp. hardback in original cloth Nice copy octavo 184pp., b/w plates, maps, Autobiography of a young Chinese woman who grew up in village China, threw off the confines of her home, unbound her feet, and joined the Revolutionary Army. Neat ownership details & rather worn green cloth boards. Uncommon. …

2nd imp. hardback in original cloth Very Good octavo 184pp., b/w plates, maps, Autobiography of a young Chinese woman who grew up in village China, threw off the confines of her home, unbound her feet, and joined the Revolutionary Army. Neat ownership details & rather worn green cloth boards. Uncommon. …

Condizione: New. pp. 236.

Condizione: New.

Condizione: New. pp. 223.

Paperback. Condizione: Brand New. revised edition. 200 pages. 9.25x6.10x0.46 inches. In Stock.

Paperback. Condizione: Brand New. rep rev edition. 240 pages. 9.25x6.10x0.63 inches. In Stock.

Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, held in Hong Kong, China, in October 2011. The 10 papers included in the book were carefully reviewed and selected from the 45 full papers and 16 special session papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.…

Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.…

Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, held in Hong Kong, China, in October 2011. The 10 papers included in the book were carefully reviewed and selected from the 45 full papers and 16 special session papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems. …

Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems. …

Taschenbuch. Condizione: Neu. VLSI-SoC: Design for Reliability, Security, and Low Power | 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised Selected Papers | Youngsoo Shin (u. a.) | Taschenbuch | IFIP Advances in Information and Communication Technology | xiii | Englisch | 2018 | Springer | EAN 9783319834405 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Taschenbuch. Condizione: Neu. VLSI-SoC: The Advanced Research for Systems on Chip | 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, Hong Kong, China, October 3-5, 2011, Revised Selected Papers | Salvador Mir (u. a.) | Taschenbuch | IFIP Advances in Information and Communication Technology | x | Englisch | 2014 | Springer | EAN 9783642445095 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

1st edition hardback in original cloth Very Good octavo 184pp., b/w plates, maps, Autobiography of a young Chinese woman who grew up in village China, threw off the confines of her home, unbound her feet, and joined the Revolutionary Army. No dust jacket but a nice copy in slightly faded green cloth boards. Uncommon.…

Hardcover. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Hardcover. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Paperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Paperback. Condizione: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condizione: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | This book contains extended and revised versions of the best papers presented at the 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, held in Hong Kong, China, in October 2011. The 10 papers included in the book were carefully reviewed and selected from the 45 full papers and 16 special session papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.…

Condizione: new. Questo è un articolo print on demand.

Condizione: new. Questo è un articolo print on demand.