Isbn: 9780128224083 - reliability and failure analysis of high-power led packaging (12 risultati)

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  • Lingua: Inglese

    Editore: Woodhead Publishing, 2022

    0128224088 / 9780128224083

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    Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices

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  • Lingua: Inglese

    Editore: Woodhead Publishing, 2022

    0128224088 / 9780128224083

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    Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections

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    Condizione: New. In English.

  • Lingua: Inglese

    Editore: Woodhead Publishing, 2022

    0128224088 / 9780128224083

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    Da: GreatBookPricesUK, Woodford Green, Regno UnitoGreatBookPricesUK

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  • Lingua: Inglese

    Editore: Woodhead Publishing, 2022

    0128224088 / 9780128224083

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    Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices

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    Condizione: Usato - Come nuovo

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    Condizione: As New. Unread book in perfect condition.

  • Lingua: Inglese

    Editore: Woodhead Publishing, 2022

    0128224088 / 9780128224083

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    Da: GreatBookPricesUK, Woodford Green, Regno UnitoGreatBookPricesUK

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    Condizione: Usato - Come nuovo

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  • Lingua: Inglese

    Editore: Elsevier Science Publishing Co Inc, US, 2022

    0128224088 / 9780128224083

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    Da: Rarewaves.com USA, London, LONDO, Regno UnitoRarewaves.com USA

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    Paperback. Condizione: New. Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs.

  • Lingua: Inglese

    Editore: Elsevier Science, 2022

    0128224088 / 9780128224083

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    Da: moluna, Greven, Germaniamoluna

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    EUR 223,66

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    Condizione: New. Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them Describes the chemistry underlying the material degradation and its impact on LEDs .

  • Lingua: Inglese

    Editore: Elsevier Science Publishing Co Inc, US, 2022

    0128224088 / 9780128224083

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    Da: Rarewaves.com UK, London, Regno UnitoRarewaves.com UK

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    Paperback. Condizione: New. Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs.

  • Lingua: Inglese

    Editore: Woodhead Publishing, 2022

    0128224088 / 9780128224083

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    • Print on Demand

    Da: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand

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    Condizione: new. Questo è un articolo print on demand.

  • Lingua: Inglese

    Editore: Woodhead Publishing, 2022

    0128224088 / 9780128224083

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    • Print on Demand

    Da: Revaluation Books, Exeter, Regno UnitoRevaluation Books

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    Paperback. Condizione: Brand New. 174 pages. 8.75x5.75x0.50 inches. In Stock. This item is printed on demand.

  • Lingua: Inglese

    Editore: Elsevier Science & Technology, Woodhead Publishing, 2022

    0128224088 / 9780128224083

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    • Print on Demand

    Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.

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    Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. Englisch.

  • Lingua: Inglese

    Editore: Elsevier Inc, 2022

    0128224088 / 9780128224083

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    • Print on Demand

    Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH

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    EUR 427,00

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    Taschenbuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs.