EUR 142,39
Quantità: 15 disponibili
Aggiungi al carrelloHRD. Condizione: New. New Book. Shipped from UK. Established seller since 2000.
EUR 150,28
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Aggiungi al carrelloCondizione: New.
EUR 142,42
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EUR 142,38
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Aggiungi al carrelloCondizione: New.
EUR 152,53
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Aggiungi al carrelloCondizione: New. In.
EUR 167,48
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Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
EUR 168,79
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Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
EUR 171,49
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Aggiungi al carrelloHardback. Condizione: New. New copy - Usually dispatched within 4 working days.
EUR 186,37
Quantità: 3 disponibili
Aggiungi al carrelloCondizione: New. pp. 312.
Condizione: New. pp. 312 1st Edition.
EUR 192,48
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Editor(s): Pecht, Michael. Num Pages: 312 pages, Ill. BIC Classification: TGP; TGX; TJFC. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 242 x 159 x 20. Weight in Grams: 539. . 1993. Hardback. . . . .
EUR 168,26
Quantità: Più di 20 disponibili
Aggiungi al carrelloGebunden. Condizione: New. Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics.
EUR 218,65
Quantità: 2 disponibili
Aggiungi al carrelloHardcover. Condizione: Brand New. 1st edition. 312 pages. 9.75x6.50x0.75 inches. In Stock.
EUR 240,52
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Editor(s): Pecht, Michael. Num Pages: 312 pages, Ill. BIC Classification: TGP; TGX; TJFC. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 242 x 159 x 20. Weight in Grams: 539. . 1993. Hardback. . . . . Books ship from the US and Ireland.
EUR 207,64
Quantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Neuware - Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.
Lingua: Inglese
Editore: John Wiley & Sons Inc, New York, 1993
ISBN 10: 047159167X ISBN 13: 9780471591672
Da: CitiRetail, Stevenage, Regno Unito
Prima edizione Print on Demand
EUR 163,40
Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: new. Hardcover. Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry. Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
Da: Revaluation Books, Exeter, Regno Unito
EUR 202,87
Quantità: 2 disponibili
Aggiungi al carrelloHardcover. Condizione: Brand New. 1st edition. 312 pages. 9.75x6.50x0.75 inches. In Stock. This item is printed on demand.
Da: THE SAINT BOOKSTORE, Southport, Regno Unito
EUR 210,51
Quantità: Più di 20 disponibili
Aggiungi al carrelloHardback. Condizione: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 569.