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michael pecht (578 risultati)
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Valutazione venditore
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Engineering for Social Change
Da: -OnTimeBooks-, Phoenix, AZ, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: very_good. Gently read. May have name of previous ownership, or ex-library edition. Binding tight; spine straight and smooth, with no creasing; covers clean and crisp. Minimal signs of handling or shelving. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item for full refund. Ships USPS Media Mail.
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Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach (Electronic Packaging)
Libro 4 di 4: Electronic PackagingDa: Budget Books, Pasadena, CA, U.S.A.
Valutazione del venditore 5 su 5 stelle
Prima edizione
Hardcover. Condizione: Fair. No Jacket. 1st Edition. This book is seriously flawed by the fact that pages 289 to 307 function as an insert. They are completely separated from the binding. But the book is all there and is otherwise in new condition. There are no tears or signs of wear to the clean pages or the cover.
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hardcover. Condizione: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Product Reliability, Maintainability, and Supportability Handbook
Da: Crossroad Books, Eau Claire, WI, U.S.A.
Valutazione del venditore 5 su 5 stelle
Hardcover. Condizione: with no dust jacket. Condizione sovraccoperta: No Dust Jacket. Ex-Corporate Library copy; with typical markings. Library label on front board and on spine tail. Slight spine twist. Pages clean, but for library markings. ; TEH22B; 413 pages; Ex-Library.
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Influence of Temperature on Microelectronics and System Reliability : A Physics of Failure Approach
Libro 4 di 4: Electronic PackagingDa: Better World Books: West, Reno, NV, U.S.A.
Valutazione del venditore 5 su 5 stelle
Prima edizione
Condizione: Good. 1st Edition. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
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Electronics Industry in Taiwan
Libro 2 di 3: The Electronics Industry Research SeriesDa: ThriftBooks-Dallas, Dallas, TX, U.S.A.
Valutazione del venditore 5 su 5 stelle
Paperback. Condizione: As New. No Jacket. Pages are clean and are not marred by notes or folds of any kind. ~ ThriftBooks: Read More, Spend Less.
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Guidebook for Managing Silicon Chip Reliability (Electronic Packaging Series)
Libro 2 di 4: Electronic PackagingDa: Goodwill of Silicon Valley, SAN JOSE, CA, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: acceptable. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Acceptable condition! Any other included accessories are also in Acceptable condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear such as cover tears discoloration, staining, marks, scuffs, etc. All pages intact.
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Affare
EUR 3,14
Spedizione EUR 16,50
Spedito da Francia a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Très bon. Ancien livre de bibliothèque. Edition 1996. Ammareal reverse jusqu'à 15% du prix net de cet article à des organisations caritatives. ENGLISH DESCRIPTION Book Condition: Used, Very good. Former library book. Edition 1996. Ammareal gives back up to 15% of this item's net price to charity organizations.
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Engineering for Social Change
Da: Bay State Book Company, North Smithfield, RI, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: very_good.
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Plastic-Encapsulated Microelectronics: Materials, Processes, Quality, Reliability, and Applications
Da: Florida Mountain Book Co., Datil, NM, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: Very Good. Hardcover, [xxxiv], 474 pages. Very Good condition/no dust jacket. Ex-library. Size 9.5"x6.5". "For the first time between two covers, here is a comprehensive, critical review of the state of the art in PEMs and assemblies that incorporate them. The most timely book on the subject, it provides professionals with a systematic, scientific exploration of crucial technical and reliability issues concerning the manufacture and use of PEMs - with special attention focusing on environment-specific applications." Library stamp on front pastedown & title page, previous owner's name on front & rear pastedowns, else Near Fine condition, clean and unmarked.
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Hardcover. Condizione: Very Good. Condizione sovraccoperta: No Dust Jacket. 1st Edition. Name of previous owner in ink inside front board. Otherwise copy is clean and unmarked in very good condition. 214 pages.
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Guidebook for Managing Silicon Chip Reliability. (=Electronic Packaging Series).
Lingua: Inglese
Editore: Taylor & Francis Inc., 1998
Da: Antiquariat Thomas Haker GmbH & Co. KG, Berlin, Germania
Membro dell'associazione: GIAQ
Valutazione del venditore 5 su 5 stelle
EUR 7,40
Spedizione EUR 20,00
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Wie neu. 224 S.; Ill. Like new. Shrink wrapped. Sprache: Englisch Gewicht in Gramm: 655.
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Guidebook for Managing Silicon Chip Reliability
Libro 2 di 4: Electronic PackagingDa: Books Puddle, New York, NY, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: New. pp. 224 1st Edition.
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Guidebook for Managing Silicon Chip Reliability
Libro 2 di 4: Electronic PackagingDa: Biblios, Frankfurt am main, HESSE, Germania
Valutazione del venditore 4 su 5 stelle
EUR 23,42
Spedizione EUR 9,95
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloCondizione: New. pp. 224.
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Electronic Packaging Materials and Their Properties
Libro 3 di 4: Electronic PackagingDa: Better World Books, Mishawaka, IN, U.S.A.
Valutazione del venditore 5 su 5 stelle
Prima edizione
Condizione: Good. 1st Edition. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
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Electronic Packaging Materials and Their Properties
Libro 3 di 4: Electronic PackagingDa: Better World Books, Mishawaka, IN, U.S.A.
Valutazione del venditore 5 su 5 stelle
Prima edizione
Condizione: Good. 1st Edition. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
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Plasticâ"Encapsulated Microelectronics: Materials, Processes, Quality, Reliability, and Applications
Da: WeBuyBooks, Rossendale, LANCS, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 20,11
Spedizione EUR 15,52
Spedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloCondizione: Good. Most items will be dispatched the same or the next working day. A copy that has been read but remains in clean condition. All of the pages are intact and the cover is intact and the spine may show signs of wear. The book may have minor markings which are not specifically mentioned. Ex library copy with usual stamps & stickers.
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Risk-Based Engineering: An Integrated Approach to Complex Systems?Special Reference to Nuclear Plants (Springer Series in Reliability Engineering)
Libro 60 di 90: Springer Series in Reliability EngineeringDa: Twice Sold Tales, Seattle, WA, U.S.A.
Valutazione del venditore 1 su 5 stelle
Hardcover. Condizione: Good. The book is in good condition with a clean interior; the cover contain minor bumps and scratches along the spine and edges. Book.
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Prognostics and Health Management of Electronics
Lingua: Inglese
Editore: Wiley & Sons, Incorporated, John, 2008
ISBN 10: 0470278021 ISBN 13: 9780470278024
Da: Better World Books: West, Reno, NV, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: Very Good. Former library copy. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
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Electronics Industry in Taiwan
Libro 2 di 3: The Electronics Industry Research SeriesDa: Books Puddle, New York, NY, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: New. pp. 176 1st Edition.
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Electronics Industry in Taiwan
Libro 2 di 3: The Electronics Industry Research SeriesDa: Biblios, Frankfurt am main, HESSE, Germania
Valutazione del venditore 4 su 5 stelle
EUR 30,92
Spedizione EUR 9,95
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloCondizione: New. pp. 176.
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Influence of Temperature on Microelectronics and System Reliability : A Physics of Failure Approach (Electronic Packaging Series)
Libro 4 di 4: Electronic PackagingDa: Dorley House Books, Inc., Hagerstown, MD, U.S.A.
Valutazione del venditore 4 su 5 stelle
Prima edizione
Hardcover. Condizione: Near Fine. B/W Photos; Diagrams, Etc (illustratore). 1st. 1st printing; glossy pictorial c; 307 clean, unmarked pages.
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Hardcover. Condizione: Acceptable. Connecting readers with great books since 1972. Used textbooks may not include companion materials such as access codes, etc. May have condition issues including wear and notes/highlighting. We ship orders daily and Customer Service is our top priority!
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Product Reliability Maintainability Supportability Handbook
Da: ThriftBooks-Atlanta, AUSTELL, GA, U.S.A.
Valutazione del venditore 5 su 5 stelle
Hardcover. Condizione: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.
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IC Component Sockets
Da: ThriftBooks-Atlanta, AUSTELL, GA, U.S.A.
Valutazione del venditore 5 su 5 stelle
Hardcover. Condizione: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.
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Lead-free Electronics.
Lingua: Inglese
Editore: New York, NY : Wiley, J, 2006
Da: Antiquariat Thomas Haker GmbH & Co. KG, Berlin, Germania
Membro dell'associazione: GIAQ
Valutazione del venditore 5 su 5 stelle
EUR 18,30
Spedizione EUR 30,00
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Sehr gut. 766 p. Very good. Shrink wrapped. Sehr guter Zustand. In Folie verschweißt. Sprache: Englisch Gewicht in Gramm: 1300.
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Electronics Industry in Taiwan
Libro 2 di 3: The Electronics Industry Research SeriesDa: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Electronics Industry in Taiwan
Libro 2 di 3: The Electronics Industry Research SeriesDa: Basi6 International, Irving, TX, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Placement and Routing of Electronic Modules
Libro 46 di 55: Electrical and Computer EngineeringDa: Books Puddle, New York, NY, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: New. pp. 352.
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Guidebook for Managing Silicon Chip Reliability
Libro 2 di 4: Electronic PackagingDa: GreatBookPrices, Columbia, MD, U.S.A.
Valutazione del venditore 5 su 5 stelle
EUR 52,98
Spedizione EUR 2,25
Spedito in U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
