9780792394501 - physical design for multichip modules: 267 di sriram, m.; kang, shin min (16 risultati)
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hardcover. Condizione: New. In shrink wrap. Looks like an interesting title.
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Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as origin…al work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided.
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Da: Mispah books, Redhill, SURRE, Regno UnitoMispah books
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Hardcover. Condizione: Like New. Like New. book.
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results a…s well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided. 218 pp. Englisch.
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Da: moluna, Greven, Germaniamoluna
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Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey…of published results as well .
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Da: preigu, Osnabrück, Germaniapreigu
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Buch. Condizione: Neu. Physical Design for Multichip Modules | Mysore Sriram (u. a.) | Buch | The Springer International Series in Engineering and Computer Science | xv | Englisch | 1994 | Springer | EAN 9780792394501 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hart…mann[at]springer[dot]com | Anbieter: preigu Print on Demand.
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Buch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as we…ll as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated.Points of interest include : Clear overview of MCM technology and its relationship to physical design;Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects;Different approaches to multilayer MCM routing collected together and compared for the first time;Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach;Quantitative data provided wherever possible for comparison of different approaches;A comprehensive list of references to recent literature on MCMs provided.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 218 pp. Englisch.
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Da: Majestic Books, Hounslow, Regno UnitoMajestic Books
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Condizione: New. Print on Demand pp. 220 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
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Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
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Condizione: New. PRINT ON DEMAND pp. 220.
