ISBN: 9780849396243 - guidebook for managing silicon chip reliability (27 risultati)

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Hardcover. Condizione: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.

Hardcover. Condizione: Wie neu. 224 S.; Ill. Like new. Shrink wrapped. Sprache: Englisch Gewicht in Gramm: 655.

Hardcover. Condizione: Very Good. No Dust Jacket. 1st Edition. Name of previous owner in ink inside front board. Otherwise copy is clean and unmarked in very good condition. 214 pages.

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Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

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Hardcover. Condizione: New. In shrink wrap. Looks like an interesting title.

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Condizione: Used. pp. 224 1st Edition.

Condizione: Used. pp. 224.

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Condizione: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.

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Condizione: As New. Unread book in perfect condition.

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Condizione: New. In English.

Hardcover. Condizione: Brand New. 1st edition. 224 pages. 10.00x6.50x0.75 inches. In Stock.

Condizione: Used. pp. 224 6 equations This item is printed on demand.

Gebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Pecht, Michael Radojcic, Riko Rao, GopalAchieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook. …

Buch. Condizione: Neu. Guidebook for Managing Silicon Chip Reliability | Michael Pecht (u. a.) | Buch | Einband - fest (Hardcover) | Englisch | 1998 | CRC Press | EAN 9780849396243 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu Print on Demand. …

Buch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future Chapters discuss:failure sites, operational loads, and failure mechanismintrinsic device sensitivitieselectromigrationhot carrier agingtime dependent dielectric breakdownmechanical stress induced migrationalpha particle sensitivityelectrostatic discharge (ESD) and electrical overstresslatch-upqualificationscreeningguidelines for designing reliabilityGuidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.…