9781461375968 - reliability, yield, and stress burn-in: a unified approach for microelectronics systems manufacturing & software development di way kuo, .; wei-ting kary chien; taeho kim (9 risultati)

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    • Lingua: Inglese

      Editore: Springer, 2014

      1461375967 / 9781461375968

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      Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections

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    • Lingua: Inglese

      Editore: Springer Us, 2014

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      Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH

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      Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: - the economic impact of employing the microelectronics fabricated by in dustry, - a study of the relationship between reliability and yield, - the progression toward miniaturization and higher reliability, and - the correctness and complexity of new system designs, which include a very significant portion of software.

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      Lingua: Inglese

      Editore: Springer Nature B.V., 2014

      1461375967 / 9781461375968

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      Da: preigu, Osnabrück, Germaniapreigu

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      Taschenbuch. Condizione: Neu. Reliability, Yield, and Stress Burn-In | A Unified Approach for Microelectronics Systems Manufacturing & Software Development | Way Kuo (u. a.) | Taschenbuch | Einband - flex.(Paperback) | Englisch | 2014 | Springer Nature B.V. | EAN 9781461375968 | Verantwortliche Person für die EU: Springer Heidelberg, Tiergartenstr. 17, 69121 Heidelberg, buchhandel-buch[at]springer[dot]com | Anbieter: preigu.

    • Lingua: Inglese

      Editore: Springer US, 2014

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      Da: moluna, Greven, Germaniamoluna

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    • Lingua: Inglese

      Editore: Springer, 2014

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      Da: Books Puddle, New York, NY, U.S.A.Books Puddle

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      Condizione: New. pp. 424.

    • Lingua: Inglese

      Editore: Springer, 2014

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      Da: Revaluation Books, Exeter, Regno UnitoRevaluation Books

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      Paperback. Condizione: Brand New. 420 pages. 9.30x6.20x1.00 inches. In Stock.

    • Lingua: Inglese

      Editore: Springer US Mrz 2014, 2014

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      Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.

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      Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: - the economic impact of employing the microelectronics fabricated by in dustry, - a study of the relationship between reliability and yield, - the progression toward miniaturization and higher reliability, and - the correctness and complexity of new system designs, which include a very significant portion of software. 424 pp. Englisch.

    • Lingua: Inglese

      Editore: Springer, 2014

      1461375967 / 9781461375968

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      Da: Majestic Books, Hounslow, Regno UnitoMajestic Books

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      Condizione: New. Print on Demand pp. 424 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.

    • Lingua: Inglese

      Editore: Springer, 2014

      1461375967 / 9781461375968

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      Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios

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      Condizione: New. PRINT ON DEMAND pp. 424.