9783319830865 - 3d microelectronic packaging: from fundamentals to applications: 57 (11 risultati)
Lingua: Inglese
Editore: Springer 2018
Serie: Springer Series in Advanced Microelectronics, Libro 61 di 72. Libro 61 di 72 - Springer Series in Advanced Microelectronics
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Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
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Lingua: Inglese
Editore: Springer 2018
Serie: Springer Series in Advanced Microelectronics, Libro 61 di 72. Libro 61 di 72 - Springer Series in Advanced Microelectronics
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Taschenbuch. Condizione: Neu. 3D Microelectronic Packaging | From Fundamentals to Applications | Yan Li (u. a.) | Taschenbuch | Springer Series in Advanced Microelectronics | ix | Englisch | 2018 | Springer | EAN 9783319830865 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen…[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Lingua: Inglese
Editore: Springer 2018
Serie: Springer Series in Advanced Microelectronics, Libro 61 di 72. Libro 61 di 72 - Springer Series in Advanced Microelectronics
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condizione: New. Softcover reprint of the original 1st ed. 2017 edition NO-PA16APR2015-KAP.
Lingua: Inglese
Editore: Springer 2018
Serie: Springer Series in Advanced Microelectronics, Libro 61 di 72. Libro 61 di 72 - Springer Series in Advanced Microelectronics
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelect…ronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
Lingua: Inglese
Editore: Springer 2018
Serie: Springer Series in Advanced Microelectronics, Libro 61 di 72. Libro 61 di 72 - Springer Series in Advanced Microelectronics
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Da: Mispah books, Redhill, SURRE, Regno UnitoMispah books
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Paperback. Condizione: New. New. book.
Lingua: Inglese
Editore: Springer 2018
Serie: Springer Series in Advanced Microelectronics, Libro 61 di 72. Libro 61 di 72 - Springer Series in Advanced Microelectronics
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Da: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand
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Condizione: new. Questo è un articolo print on demand.
Lingua: Inglese
Editore: Springer International Publishing 2018
Serie: Springer Series in Advanced Microelectronics, Libro 61 di 72. Libro 61 di 72 - Springer Series in Advanced Microelectronics
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Da: moluna, Greven, Germaniamoluna
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Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an indus…try trend for future microelectronic pack.
Lingua: Inglese
Editore: Springer International Publishing Jul 2018 2018
Serie: Springer Series in Advanced Microelectronics, Libro 61 di 72. Libro 61 di 72 - Springer Series in Advanced Microelectronics
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for f…uture microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. 476 pp. Englisch.
Lingua: Inglese
Editore: Springer International Publishing, Springer International Publishing Jul 2018 2018
Serie: Springer Series in Advanced Microelectronics, Libro 61 di 72. Libro 61 di 72 - Springer Series in Advanced Microelectronics
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
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Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for futur…e microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 476 pp. Englisch.
Lingua: Inglese
Editore: Springer 2018
Serie: Springer Series in Advanced Microelectronics, Libro 61 di 72. Libro 61 di 72 - Springer Series in Advanced Microelectronics
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Da: Majestic Books, Hounslow, Regno UnitoMajestic Books
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Condizione: New. Print on Demand.
Lingua: Inglese
Editore: Springer 2018
Serie: Springer Series in Advanced Microelectronics, Libro 61 di 72. Libro 61 di 72 - Springer Series in Advanced Microelectronics
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Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
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