Isbn: 9786130993849 (4 risultati)

Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Please note that the content of this book primarily consists of articles available from Wikipedia or other free sources online. Wafer-Level Packaging (WLP) refers to the technology of packaging an integrated circuit at wafer level. WLP is essentially a true chip scale package (CSP) technology, since the resulting package is practically of the same size as the die. Wafer-level packaging has the ability to enable true integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment. 88 pp. Englisch.…

Taschenbuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Please note that the content of this book primarily consists of articles available from Wikipedia or other free sources online. Wafer-Level Packaging (WLP) refers to the technology of packaging an integrated circuit at wafer level. WLP is essentially a true chip scale package (CSP) technology, since the resulting package is practically of the same size as the die. Wafer-level packaging has the ability to enable true integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.…

Taschenbuch. Condizione: Neu. Wafer-Level Packaging | Chip Scale Package, Wafer Dicing, Wafer-Scale Integration, Wafer (Electronics), Semiconductor | Lambert M. Surhone (u. a.) | Taschenbuch | Englisch | 2026 | OmniScriptum | EAN 9786130993849 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu Print on Demand. …

Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Please note that the content of this book primarily consists of articlesavailable from Wikipedia or other free sources online. Wafer-LevelPackaging (WLP) refers to the technology of packaging an integratedcircuit at wafer level. WLP is essentially a true chip scale package(CSP) technology, since the resulting package is practically of the samesize as the die. Wafer-level packaging has the ability to enable trueintegration of wafer fab, packaging, test, and burn-in at wafer level inorder to streamline the manufacturing process undergone by a device fromsilicon start to customer shipment.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 88 pp. Englisch.…