Da: Anybook.com, Lincoln, Regno Unito
EUR 32,82
Convertire valutaQuantità: 1 disponibili
Aggiungi al carrelloCondizione: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings With owner's name inside cover. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1100grams, ISBN:9780412084515.
Da: Anybook.com, Lincoln, Regno Unito
EUR 33,21
Convertire valutaQuantità: 1 disponibili
Aggiungi al carrelloCondizione: Good. Volume 3. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1150grams, ISBN:9780412084515.
Da: The Maryland Book Bank, Baltimore, MD, U.S.A.
EUR 11,54
Convertire valutaQuantità: 1 disponibili
Aggiungi al carrellohardcover. Condizione: Very Good. 2nd. Used - Very Good.
EUR 11,54
Convertire valutaQuantità: 1 disponibili
Aggiungi al carrellohardcover. Condizione: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
Da: BennettBooksLtd, San Diego, NV, U.S.A.
EUR 120,89
Convertire valutaQuantità: 1 disponibili
Aggiungi al carrellohardcover. Condizione: New. In shrink wrap. Looks like an interesting title!
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 165,14
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
EUR 158,86
Convertire valutaQuantità: 15 disponibili
Aggiungi al carrelloCondizione: New.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 163,27
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Da: California Books, Miami, FL, U.S.A.
EUR 177,69
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
EUR 176,57
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloGebunden. Condizione: New. This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books.
EUR 181,13
Convertire valutaQuantità: 15 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 192,75
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: Lucky's Textbooks, Dallas, TX, U.S.A.
EUR 157,68
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 245,92
Convertire valutaQuantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Neuware - This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables.Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development.Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail.Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 259,76
Convertire valutaQuantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Like New. Like New. book.