EUR 55,89
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Aggiungi al carrelloHardcover. Condizione: New.
EUR 67,55
Quantità: 3 disponibili
Aggiungi al carrelloCondizione: New. pp. 136.
Condizione: New. pp. 136.
EUR 62,45
Quantità: 2 disponibili
Aggiungi al carrelloHardcover. Condizione: Brand New. 100 pages. 9.25x6.25x0.75 inches. In Stock.
Editore: ISTE Press Ltd - Elsevier Inc, 2017
ISBN 10: 1785480960 ISBN 13: 9781785480966
Lingua: Inglese
Da: THE SAINT BOOKSTORE, Southport, Regno Unito
EUR 69,55
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Aggiungi al carrelloHardback. Condizione: New. New copy - Usually dispatched within 4 working days. 350.
Da: Biblios, Frankfurt am main, HESSE, Germania
EUR 76,76
Quantità: 3 disponibili
Aggiungi al carrelloCondizione: New. pp. 136.
Da: Brook Bookstore On Demand, Napoli, NA, Italia
EUR 55,70
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Aggiungi al carrelloCondizione: new. Questo è un articolo print on demand.
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 72,40
Quantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Plasma etching has long enabled the perpetuation of Moore's Law. Today, etch compensation helps to create devices that are smaller than 20 nm. But, with the constant downscaling in device dimensions and the emergence of complex 3D structures (like FinFet, Nanowire and stacked nanowire at longer term) and sub 20 nm devices, plasma etching requirements have become more and more stringent.Now more than ever, plasma etch technology is used to push the limits of semiconductor device fabrication into the nanoelectronics age. This will require improvement in plasma technology (plasma sources, chamber design, etc.), new chemistries (etch gases, flows, interactions with substrates, etc.) as well as a compatibility with new patterning techniques such as multiple patterning, EUV lithography, Direct Self Assembly, ebeam lithography or nanoimprint lithography.This book presents these etch challenges and associated solutions encountered throughout the years for transistor realization. Englisch.
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 76,66
Quantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Plasma etching has long enabled the perpetuation of Moore's Law. Today, etch compensation helps to create devices that are smaller than 20 nm. But, with the constant downscaling in device dimensions and the emergence of complex 3D structures (like FinFet, Nanowire and stacked nanowire at longer term) and sub 20 nm devices, plasma etching requirements have become more and more stringent.Now more than ever, plasma etch technology is used to push the limits of semiconductor device fabrication into the nanoelectronics age. This will require improvement in plasma technology (plasma sources, chamber design, etc.), new chemistries (etch gases, flows, interactions with substrates, etc.) as well as a compatibility with new patterning techniques such as multiple patterning, EUV lithography, Direct Self Assembly, ebeam lithography or nanoimprint lithography.This book presents these etch challenges and associated solutions encountered throughout the years for transistor realization.