Design-for-test and Test Optimization Techniques for Tsv-based 3d Stacked Ics - Rilegato

Noia, Brandon; Chakrabarty, Krishnendu

Rilegato

ISBN 10: 3319023772 ISBN 13: 9783319023779

Casa editrice: Springer Nature, 2013

Riassunto

This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.

Su questo libro

Informazioni sull?autore

Krishnendu Chakrabarty is a Professor of Electrical and Computer Engineering at Duke University. He received his PhD from University of Michigan. He is a Fellow of IEEE and a Distinguished Engineer of ACM.

Dalla quarta di copertina

This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.

• Provides a comprehensive guide to the challenges and solutions for the testing of TSV-based 3D stacked ICs;
• Includes in-depth explanation of key test and design-for-test technologies, emerging standards, and test- architecture and test-schedule optimizations;
• Encompasses all aspects of test as related to 3D ICs, including pre-bond and post-bond test as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective.

Dettagli dell'edizione

• Editore: Springer Nature
• Data di pubblicazione: 2013
• Lingua: Inglese
• ISBN 10: 3319023772
• ISBN 13: 9783319023779
• Rilegatura: Copertina rigida
• Numero di pagine: 245
• Contatto del produttore: non disponibile
• Persona responsabile: CMN Printpool Inh. Mathis Neumann; https://www.also.com/ec/cms5/en_6000/6000/index.jsp; ; Friedrich-Karl-Str. 9; Hamburg; Germania