Borst christopher lyle (23 risultati)
Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses. Fundamental Mechanisms and Application to IC Interconnect Technology.
Borst, Christopher Lyle, William N. Gill and Ronald J. Gutmann:
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Da: Antiquariat Thomas Haker GmbH & Co. KG, Berlin, GermaniaAntiquariat Thomas Haker GmbH & Co. KG
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Hardcover. Condizione: Sehr gut. 243 S.; Ill. Very good. Shrink wrapped. Sprache: Englisch Gewicht in Gramm: 685.
Chemical-Mechanical Polishing Of Low Dielectric Constant Polymers And Organosilicate Glasses (Hb)
Borst, Christopher Lyle; Gill, William N.; Gutmann, Ronald J.
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Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
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Chemical-Mechanical Polishing Of Low Dielectric Constant Polymers And Organosilicate Glasses (Hb)
Borst, Christopher Lyle; Gill, William N.; Gutmann, Ronald J.
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Da: SMASS Sellers, IRVING, TX, U.S.A.SMASS Sellers
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Chemical-mechanical Polishing Of Low Dielectric Constant Polymers And Organosilicate Glasses: Fundamental Mechanisms And Application To Ic Interconnect Technology
Borst, Christopher Lyle; Gill, William N.; Gutmann, Ronald J.
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Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
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Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology
Borst, Christopher Lyle Lyle; Gill, William N.; Gutmann, Ronald J.
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Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
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Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology
Borst, Christopher Lyle; Gill, William N.; Gutmann, Ronald J.
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Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
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Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses : Fundamental Mechanisms and Application to Ic Interconnect Technology
Borst, Christopher Lyle; Gill, William N.; Gutmann, Ronald J.
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Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses : Fundamental Mechanisms and Application to Ic Interconnect Technology
Borst, Christopher Lyle; Gill, William N.; Gutmann, Ronald J.
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Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Altre immagini- Brossura
Da: preigu, Osnabrück, Germaniapreigu
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EUR 140,10
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Taschenbuch. Condizione: Neu. Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses | Fundamental Mechanisms and Application to IC Interconnect Technology | Christopher Lyle Borst (u. a.) | Taschenbuch | xiv | Englisch | 2014 | Springer US | EAN 9781461354246 | Verantwortliche Person für di…e EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condizione: New. pp. 248.
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagati…on allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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EUR 168,73
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Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allo…wed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.
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Da: Revaluation Books, Exeter, Regno UnitoRevaluation Books
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Paperback. Condizione: Brand New. 243 pages. 9.30x6.20x0.55 inches. In Stock.
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Da: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand
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Condizione: new. Questo è un articolo print on demand.
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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EUR 160,49
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Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster…signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning. 248 pp. Englisch.
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal…propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning. 252 pp. Englisch.
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Da: moluna, Greven, Germaniamoluna
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Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower po…wer and faster signal propagation allo.
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Da: moluna, Greven, Germaniamoluna
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Gebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of th…e lower power and faster signal propagation allo.
Altre immagini- Rilegato
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Da: preigu, Osnabrück, Germaniapreigu
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Buch. Condizione: Neu. Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses | Fundamental Mechanisms and Application to IC Interconnect Technology | Christopher Lyle Borst (u. a.) | Buch | xiv | Englisch | 2002 | Springer US | EAN 9781402071935 | Verantwortliche Person für die EU: Springer… Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
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EUR 160,49
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Buch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal prop…agation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials.The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 252 pp. Englisch.
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 160,49
EUR 60,00 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster sign…al propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials.The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 248 pp. Englisch.
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Da: Majestic Books, Hounslow, Regno UnitoMajestic Books
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Condizione: New. Print on Demand pp. 248 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
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Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
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Condizione: New. PRINT ON DEMAND pp. 248.
