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Copper--Fundamental Mechanisms for Microelectronic Applications
Lingua: Inglese
Editore: Wiley, New York, 2000
Da: Pride and Prejudice-Books, Ballston Lake, NY, U.S.A.
Valutazione del venditore 5 su 5 stelle
Prima edizione
Hardcover. Condizione: As New. 1st Edition. First Edition. Original boards. As New. No Dust Jacket.
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Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology
Lingua: Inglese
Editore: Kluwer Academic Publishers, Boston, 2002
ISBN 10: 1402071930 ISBN 13: 9781402071935
Da: Florida Mountain Book Co., Datil, NM, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: Very Good. Hardcover, [xiv], 229 pages. Very Good condition. Size 9.5"x6.25". "The focus of this book is to merge the complex chemical-mechanical planarization (CMP) models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning." Book has moderate exterior shelfwear/soiling. Binding is tight. Gift inscription on front fly, text else Fine condition, clean and unmarked.
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Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses. Fundamental Mechanisms and Application to IC Interconnect Technology.
Lingua: Inglese
Editore: Springer, 2002
Da: Antiquariat Thomas Haker GmbH & Co. KG, Berlin, Germania
Membro dell'associazione: GIAQ
Valutazione del venditore 5 su 5 stelle
EUR 17,30
Spedizione EUR 20,00
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Sehr gut. 243 S.; Ill. Very good. Shrink wrapped. Sprache: Englisch Gewicht in Gramm: 685.
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Employee Benefits Law
Lingua: Inglese
Editore: BNA Books (Bureau of National Affairs), 2000
ISBN 10: 1570181284 ISBN 13: 9781570181283
Da: ThriftBooks-Dallas, Dallas, TX, U.S.A.
Valutazione del venditore 5 su 5 stelle
Hardcover. Condizione: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.
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Chemical-Mechanical Polishing Of Low Dielectric Constant Polymers And Organosilicate Glasses (Hb)
Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Condizione: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
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Condizione: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
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On Risk and Disaster: Lessons from Hurricane Katrina
Lingua: Inglese
Editore: University of Pennsylvania Press, 2006
ISBN 10: 0812219597 ISBN 13: 9780812219593
Da: BennettBooksLtd, Los Angeles, CA, U.S.A.
Valutazione del venditore 5 su 5 stelle
paperback. Condizione: New. In shrink wrap. Looks like an interesting title!
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EUR 35,85
Spedizione EUR 48,99
Spedito da Germania a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. Leading experts address questions of public and private roles in assessing, managing, and mitigating major risks to public health and safety in light of the devastation caused by Hurricane Katrina.Über den AutorRonald J. Daniels.
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COPPER-FUNDAMENTAL MECHANISMS FOR MICROELECTRONIC APPLICATIONS
Da: Basi6 International, Irving, TX, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Wafer Level 3-d Ics Process Technology (integrated Circuits And Systems)
Libro 20 di 34: Integrated Circuits and SystemsDa: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Chemical-mechanical Polishing Of Low Dielectric Constant Polymers And Organosilicate Glasses: Fundamental Mechanisms And Application To Ic Interconnect Technology
Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Wafer Level 3-d Ics Process Technology (integrated Circuits And Systems)
Libro 20 di 34: Integrated Circuits and SystemsDa: Basi6 International, Irving, TX, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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COPPER--FUNDAMENTAL MECHANISMS FOR MICROELECTRONICAPPLICATIONS
Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Condizione: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
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Condizione: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
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Copper-Fundamental Mechanisms for Microelectronic Applications
Da: Books Puddle, New York, NY, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: New. pp. xxviii + 337 1st Edition.
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Copper-Fundamental Mechanisms for Microelectronic Applications
Da: Majestic Books, Hounslow, Regno Unito
Valutazione del venditore 4 su 5 stelle
EUR 168,49
Spedizione EUR 7,53
Spedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloCondizione: New. pp. xxviii + 337 Illus.
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Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)
Libro 20 di 34: Integrated Circuits and SystemsDa: Ria Christie Collections, Uxbridge, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 163,15
Spedizione EUR 13,87
Spedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
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Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)
Da: Ria Christie Collections, Uxbridge, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 164,41
Spedizione EUR 13,87
Spedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
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Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology
Da: Ria Christie Collections, Uxbridge, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 164,41
Spedizione EUR 13,87
Spedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
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Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology
Da: Ria Christie Collections, Uxbridge, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 164,41
Spedizione EUR 13,87
Spedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
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Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses
Da: Books Puddle, New York, NY, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: New. pp. 248.
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Wafer Level 3-D ICS Process Technology
Da: Books Puddle, New York, NY, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: New. pp. 376.
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Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses
Lingua: Inglese
Editore: Kluwer Academic Publishers, 2002
ISBN 10: 1402071930 ISBN 13: 9781402071935
Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
Valutazione del venditore 5 su 5 stelle
EUR 200,60
Spedizione EUR 10,50
Spedito da Irlanda a U.S.A.Quantità: 15 disponibili
Aggiungi al carrelloCondizione: New. Merges the complex chemical-mechanical planarization (CMP) models and mechanisms that have evolved over the years with experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. This book looks into the fundamental reaction kinetics. Num Pages: 229 pages, biography. BIC Classification: TDCP. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 15. Weight in Grams: 532. . 2002. Hardback. . . . .
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EUR 140,00
Spedizione EUR 70,00
Spedito da Germania a U.S.A.Quantità: 5 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Wafer Level 3-D ICS Process Technology | Chuan Seng Tan (u. a.) | Taschenbuch | xii | Englisch | 2010 | Springer Us | EAN 9781441945624 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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EUR 168,73
Spedizione EUR 62,63
Spedito da Germania a U.S.A.Quantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry's vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamental motivation behind 3D technologies which vertically stack several strata of device and interconnect layers with high vertical interconnectivity. In addition, the ability to vertically stack strata with - vergent and even incompatible process ows provides for low cost and low parasitic integration of diverse technologies such as sensors, energy scavengers, nonvolatile memory, dense memory, fast memory, processors, and RF layers. These capabilities coupled with today's trends of increasing levels of integrated functionality, lower power, smaller form factor, increasingly divergent process ows, and functional diversi cation would seem to make 3D technologies a natural choice for most of the semiconductor industry. Since the concept of vertical integration of different strata has been around for over 20 years, why aren't vertically stacked strata endemic to the semiconductor industry The simple answer to this question is that in the past, the 3D advantages while interesting were not necessary due to the tremendous opportunities offered by geometric scaling. In addition, even when the global interconnect problem of high-performance single-core processors seemed insurmountable without inno- tions such as 3D, alternative architectural solutions such as multicores could eff- tivelydelaybutnoteliminatetheneedfor3D.
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EUR 168,73
Spedizione EUR 63,65
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry's vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamental motivation behind 3D technologies which vertically stack several strata of device and interconnect layers with high vertical interconnectivity. In addition, the ability to vertically stack strata with - vergent and even incompatible process ows provides for low cost and low parasitic integration of diverse technologies such as sensors, energy scavengers, nonvolatile memory, dense memory, fast memory, processors, and RF layers. These capabilities coupled with today's trends of increasing levels of integrated functionality, lower power, smaller form factor, increasingly divergent process ows, and functional diversi cation would seem to make 3D technologies a natural choice for most of the semiconductor industry. Since the concept of vertical integration of different strata has been around for over 20 years, why aren't vertically stacked strata endemic to the semiconductor industry The simple answer to this question is that in the past, the 3D advantages while interesting were not necessary due to the tremendous opportunities offered by geometric scaling. In addition, even when the global interconnect problem of high-performance single-core processors seemed insurmountable without inno- tions such as 3D, alternative architectural solutions such as multicores could eff- tivelydelaybutnoteliminatetheneedfor3D.
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Wafer Level 3-D ICs Process Technology (Series on Integrated Circuits and Systems)
Libro 20 di 34: Integrated Circuits and SystemsDa: Revaluation Books, Exeter, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 236,25
Spedizione EUR 14,47
Spedito da Regno Unito a U.S.A.Quantità: 2 disponibili
Aggiungi al carrelloHardcover. Condizione: Brand New. 1st edition. 410 pages. 9.75x9.50x0.75 inches. In Stock.
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Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses
Lingua: Inglese
Editore: Kluwer Academic Publishers, 2002
ISBN 10: 1402071930 ISBN 13: 9781402071935
Da: Kennys Bookstore, Olney, MD, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: New. Merges the complex chemical-mechanical planarization (CMP) models and mechanisms that have evolved over the years with experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. This book looks into the fundamental reaction kinetics. Num Pages: 229 pages, biography. BIC Classification: TDCP. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 15. Weight in Grams: 532. . 2002. Hardback. . . . . Books ship from the US and Ireland.
