Gutmann ronald j (42 risultati)

Hardcover. Condizione: Sehr gut. 243 S.; Ill. Very good. Shrink wrapped. Sprache: Englisch Gewicht in Gramm: 685.

paperback. Condizione: New. In shrink wrap. Looks like an interesting title.

Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

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Condizione: Good. : Este libro es una guía completa sobre el estado del arte y la dirección futura de la tecnología de interconexión de cobre. Debido a sus ventajas de rendimiento, la metalización de cobre para la interconexión de circuitos integrados está atrayendo un gran interés en la comunidad de semiconductores en todo el mundo. Los autores se basan en más de una década de participación en la investigación de interconexión de cobre, integrando grandes cantidades de conocimiento disponible y aclarando la conexión entre los principios mecanicistas y las tecnologías relevantes. Cuenta con amplias referencias, tablas y más de 100 ilustraciones, incluyendo el patrón de doble Damasceno necesario para las interconexiones de cobre. EAN: 9780471252566 Tipo: Libros Categoría: Tecnología|Ciencias Título: Copper-Fundamental Mechanisms for Microelectronic Applications Autor: Shyam P. Murarka| Igor V. Verner| Ronald J. Gutmann Editorial: Wiley-Interscience Idioma: en Páginas: 384 Formato: tapa dura.…

Condizione: New. Leading experts address questions of public and private roles in assessing, managing, and mitigating major risks to public health and safety in light of the devastation caused by Hurricane Katrina.&Uumlber den AutorRonald J. Daniels.

Condizione: good. A copy that has been read, remains in good condition. All pages are intact, and the cover is intact. The spine and cover show signs of wear. Pages can include notes and highlighting and show signs of wear, and the copy can include "From the library of" labels or previous owner inscriptions. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item! Ships via media mail.…

Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Hardcover. Condizione: Acceptable. Connecting readers with great books since 1972. Used textbooks may not include companion materials such as access codes, etc. May have condition issues including wear and notes/highlighting. We ship orders daily and Customer Service is our top priority.

Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condizione: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.

Condizione: New. In English.

Condizione: New. In English.

Condizione: New. In English.

Condizione: New. In English.

Condizione: New. pp. 248.

Condizione: New. pp. 376.

Taschenbuch. Condizione: Neu. Wafer Level 3-D ICS Process Technology | Chuan Seng Tan (u. a.) | Taschenbuch | xii | Englisch | 2010 | Springer Us | EAN 9781441945624 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Condizione: New. Merges the complex chemical-mechanical planarization (CMP) models and mechanisms that have evolved over the years with experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. This book looks into the fundamental reaction kinetics. Num Pages: 229 pages, biography. BIC Classification: TDCP. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 15. Weight in Grams: 532. . 2002. Hardback. . . . .…

Hardcover. Condizione: Brand New. 1st edition. 410 pages. 9.75x9.50x0.75 inches. In Stock.

Condizione: New. Merges the complex chemical-mechanical planarization (CMP) models and mechanisms that have evolved over the years with experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. This book looks into the fundamental reaction kinetics. Num Pages: 229 pages, biography. BIC Classification: TDCP. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 15. Weight in Grams: 532. . 2002. Hardback. . . . . Books ship from the US and Ireland.…

Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry's vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamental motivation behind 3D technologies which vertically stack several strata of device and interconnect layers with high vertical interconnectivity. In addition, the ability to vertically stack strata with - vergent and even incompatible process ows provides for low cost and low parasitic integration of diverse technologies such as sensors, energy scavengers, nonvolatile memory, dense memory, fast memory, processors, and RF layers. These capabilities coupled with today's trends of increasing levels of integrated functionality, lower power, smaller form factor, increasingly divergent process ows, and functional diversi cation would seem to make 3D technologies a natural choice for most of the semiconductor industry. Since the concept of vertical integration of different strata has been around for over 20 years, why aren't vertically stacked strata endemic to the semiconductor industry The simple answer to this question is that in the past, the 3D advantages while interesting were not necessary due to the tremendous opportunities offered by geometric scaling. In addition, even when the global interconnect problem of high-performance single-core processors seemed insurmountable without inno- tions such as 3D, alternative architectural solutions such as multicores could eff- tivelydelaybutnoteliminatetheneedfor3D. …

Hardcover. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Paperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Encuadernación de tapa blanda. Condizione: Bien. Condizione sovraccoperta: Bien. Situation Esthetics: Impermanent Art and the Seventies Audience John Gutmann: A Transported Vision Carol Squiers Beuys: The Twilight of the Idol Benjamin H. D. Buchloh Willem de Kooning at the Pittsburgh International David Carrier Myron Stout s Complexity in Simplicity Tiffany Bell Dance : Lucinda Childs, Philip Glass and Sol LeWitt Deborah Perlberg David Reed s Paintings James Sherry Myth, Thermadorians and Solipsists Nicolas Calas COLUMNS FEATURES REVIEWS NEW YORK Stuart Morgan on Alice Aycock Stuart Morgan on Marco Bagnoli Stuart Morgan on Farrell Brickhouse Jeff Perrone on Robert Kushner Jeff Perrone on Willem de Kooning Jeff Perrone on Stefan Hirsch Jeff Perrone on Ron Gorchov Jeff Perrone on John McLaughlin Carrie Rickey on Philip Guston Carrie Rickey on Jennifer Bartlett Carrie Rickey on Steven Gianakos Carrie Rickey on Animals Living in Cities Hal Foster on Max Neuhaus Hal Foster on Richards Ruben Hal Foster on Lydia Dona Margaret Sheffield on Irving Petlin Margaret Sheffield on Don Gummer Judith Lopes Cardozo on Conrad Atkinson and Victor Burgin Judith Lopes Cardozo on Ed Kerns CAMBRIDGE Ronald J. Onorato on Corners DALLAS Fred Hoffman on Vernon Fisher LONDON Adrian Searle on Narrative Paintings Adrian Searle on John Hoyland LOS ANGELES Fred Hoffman on Chris Burden Fred Hoffman on DeWain Valentine Richard Armstrong on Jon Peterson SANTA BARBARA Richard Armstrong on Tom Wudl Richard Armstrong on Dialogue/Discourse/Research.…

Condizione: new. Questo è un articolo print on demand.

Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry. 410 pp. Englisch. …