Borst christopher (26 risultati)
Altre immaginiThe Flutist's Handbook: A Pedagogy Anthology: A Publication in Celebration of the 25th Anniversary of The National Flute Association, Inc.
Blaisdell, Frances; Debost, Micel; Floyd Angeleita; Jones Katherine Borst; Weait, Christopher; Khaner, Jeffrey; Murray, ALexander; Noe, Carol Kniebusch; Peck, Donald; Smith Fenwick; Tipton, Albert; Wilson, Ransom; Garner, Bradley; Mather, Roger; Takahashi, Toshio; Wincenc, Carol; Baxtresser, Jeanne; Buyse, Leone; Dick, Robert; Kujala, Walfrid; Rieder, Anita Miller; Thomas, Mark; Walker, Jim; Wion, John; Wye, Trevor; Fouse, Sarah Baird; Stolper, Mary
Lingua: Inglese
Editore: The National Flute Association, Inc., Santa Clarita, California, 1998
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Da: Vero Beach Books, Vero Beach, FL, U.S.A.Vero Beach Books
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EUR 40,65
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Aggiungi al carrelloSoft cover. Condizione: New. New condition maroon softcover wraps with gold front cover and spine lettering. Includes Acknowledgments; Mission of the National Flute Association, Inc.; Foreword; Preface; and Index. Illustrated with black-and-white photographs and musical notation. ".this volume offers wisdom and insight on topics… relating to the flute and flute playing from the very practical to the metaphysical. Twenty-six experienced and knowledgeable authors contributed to this unique collection. It is presented to the many thousands of flute students, teachers, and scholars in celebration of the Silver Anniversary of The National Flute Association. The reader will find many new ways of approaching old problems as well as inspirational reminders of some basic ways to deal with fundamentals. The articles are wise, elegant, probing, uplifting and stimulating. This is a collection that those devoted to making music with the flute will return to time and time again." - from the rear outer cover.
Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses. Fundamental Mechanisms and Application to IC Interconnect Technology.
Borst, Christopher Lyle, William N. Gill and Ronald J. Gutmann:
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Da: Antiquariat Thomas Haker GmbH & Co. KG, Berlin, GermaniaAntiquariat Thomas Haker GmbH & Co. KG
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Condizione: Usato - Ottimo
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Hardcover. Condizione: Sehr gut. 243 S.; Ill. Very good. Shrink wrapped. Sprache: Englisch Gewicht in Gramm: 685.
Chemical-Mechanical Polishing Of Low Dielectric Constant Polymers And Organosilicate Glasses (Hb)
Borst, Christopher Lyle; Gill, William N.; Gutmann, Ronald J.
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Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
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EUR 77,27
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Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Chemical-Mechanical Polishing Of Low Dielectric Constant Polymers And Organosilicate Glasses (Hb)
Borst, Christopher Lyle; Gill, William N.; Gutmann, Ronald J.
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Da: SMASS Sellers, IRVING, TX, U.S.A.SMASS Sellers
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EUR 79,97
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Condizione: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
Chemical-mechanical Polishing Of Low Dielectric Constant Polymers And Organosilicate Glasses: Fundamental Mechanisms And Application To Ic Interconnect Technology
Borst, Christopher Lyle; Gill, William N.; Gutmann, Ronald J.
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Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
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EUR 101,90
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Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology
Borst, Christopher Lyle Lyle; Gill, William N.; Gutmann, Ronald J.
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Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
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EUR 166,59
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Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology
Borst, Christopher Lyle; Gill, William N.; Gutmann, Ronald J.
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Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
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EUR 166,59
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Condizione: New. In.
Altre immagini- Brossura
Da: preigu, Osnabrück, Germaniapreigu
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EUR 140,10
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Taschenbuch. Condizione: Neu. Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses | Fundamental Mechanisms and Application to IC Interconnect Technology | Christopher Lyle Borst (u. a.) | Taschenbuch | xiv | Englisch | 2014 | Springer US | EAN 9781461354246 | Verantwortliche Person für di…e EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandaKennys Bookshop and Art Galleries Ltd.
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EUR 200,60
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Condizione: New. Merges the complex chemical-mechanical planarization (CMP) models and mechanisms that have evolved over the years with experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. This book looks into the fundamental reaction kinetics. Num Page…s: 229 pages, biography. BIC Classification: TDCP. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 15. Weight in Grams: 532. . 2002. Hardback. . . . .
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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EUR 213,27
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Condizione: New. pp. 248.
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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EUR 167,14
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Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagati…on allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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EUR 168,73
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Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allo…wed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.
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Da: Revaluation Books, Exeter, Regno UnitoRevaluation Books
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EUR 236,52
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Paperback. Condizione: Brand New. 243 pages. 9.30x6.20x0.55 inches. In Stock.
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Da: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
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EUR 254,72
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Condizione: New. Merges the complex chemical-mechanical planarization (CMP) models and mechanisms that have evolved over the years with experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. This book looks into the fundamental reaction kinetics. Num Page…s: 229 pages, biography. BIC Classification: TDCP. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 15. Weight in Grams: 532. . 2002. Hardback. . . . . Books ship from the US and Ireland.
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Da: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand
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Condizione: new. Questo è un articolo print on demand.
Chemical-Mechanical Polishing of Low Dielectric Co
Borst, Christopher Lyle Lyle; Gill, William N.; Gutmann, Ronald J.
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- Print on Demand
Da: Basi6 International, Irving, TX, U.S.A.Basi6 International
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Condizione: Brand New. New. US edition. Print on demand title. Delivery takes 20-25 days. Excellent Customer Service.
Chemical-Mechanical Polishing of Low Dielectric Co
Borst, Christopher Lyle; Gill, William N.; Gutmann, Ronald J.
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- Print on Demand
Da: Basi6 International, Irving, TX, U.S.A.Basi6 International
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EUR 139,15
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Condizione: Brand New. New. US edition. Print on demand title. Delivery takes 20-25 days. Excellent Customer Service.
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- Print on Demand
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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EUR 160,49
EUR 23,00 spedizioneSpedito da Germania a U.S.A.Quantità: 2 disponibili
Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster…signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning. 248 pp. Englisch.
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal…propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning. 252 pp. Englisch.
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Da: moluna, Greven, Germaniamoluna
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EUR 136,16
EUR 48,99 spedizioneSpedito da Germania a U.S.A.Quantità: Più di 20 disponibili
Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower po…wer and faster signal propagation allo.
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- Print on Demand
Da: moluna, Greven, Germaniamoluna
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 136,16
EUR 48,99 spedizioneSpedito da Germania a U.S.A.Quantità: Più di 20 disponibili
Gebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of th…e lower power and faster signal propagation allo.
Altre immagini- Rilegato
- Print on Demand
Da: preigu, Osnabrück, Germaniapreigu
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EUR 141,20
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Buch. Condizione: Neu. Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses | Fundamental Mechanisms and Application to IC Interconnect Technology | Christopher Lyle Borst (u. a.) | Buch | xiv | Englisch | 2002 | Springer US | EAN 9781402071935 | Verantwortliche Person für die EU: Springer… Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
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- Print on Demand
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
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EUR 160,49
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Buch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal prop…agation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials.The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 252 pp. Englisch.
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- Print on Demand
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 160,49
EUR 60,00 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster sign…al propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials.The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 248 pp. Englisch.
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Da: Majestic Books, Hounslow, Regno UnitoMajestic Books
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Condizione: New. Print on Demand pp. 248 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
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Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
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EUR 228,41
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Condizione: New. PRINT ON DEMAND pp. 248.
