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jillian evans (59 risultati)
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Life Lessons Through a Teacher's Eyes
Da: ThriftBooks-Atlanta, AUSTELL, GA, U.S.A.
Valutazione del venditore 5 su 5 stelle
Paperback. Condizione: Very Good. No Jacket. Julie Evans. Sarah Schultz (illustratore). May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.
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The Fascial Network
Lingua: Inglese
Editore: Meyer & Meyer Sport, Limited, 2015
ISBN 10: 1782550690 ISBN 13: 9781782550693
Da: Better World Books: West, Reno, NV, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: Good. Former library book; may include library markings. Used book that is in clean, average condition without any missing pages.
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The Fascial Network
Lingua: Inglese
Editore: Meyer & Meyer Sport, Limited, 2015
ISBN 10: 1782550690 ISBN 13: 9781782550693
Da: Better World Books, Mishawaka, IN, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: Good. Former library book; may include library markings. Used book that is in clean, average condition without any missing pages.
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Life Lessons Through a Teacher's Eyes
Da: One Planet Books, Columbia, MO, U.S.A.
Valutazione del venditore 5 su 5 stelle
Prima edizione
paperback. Condizione: Like New. Julie Evans. Sarah Schultz (illustratore). First Edition. Ships in a BOX from Central Missouri! Like Brand NEW. No tears, highlighting or writing because it's never been used! May have minor shelf wear. UPS shipping for most packages, (Priority Mail for AK/HI/APO/PO Boxes).
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LIFE LESSONS THROUGH A TEACHER'S EYE
Da: GreatBookPrices, Columbia, MD, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: New. Julie Evans. Sarah Schultz (illustratore).
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paperback. Condizione: New. Julie Evans. Sarah Schultz (illustratore).
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LIFE LESSONS THROUGH A TEACHER'S EYE
Da: GreatBookPrices, Columbia, MD, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: As New. Julie Evans. Sarah Schultz (illustratore). Unread book in perfect condition.
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Life Lessons Through a Teacher's Eyes
Da: Textbooks_Source, Columbia, MO, U.S.A.
Valutazione del venditore 5 su 5 stelle
Prima edizione
EUR 10,50
Spedizione EUR 3,42
Spedito in U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrellopaperback. Condizione: New. Julie Evans. Sarah Schultz (illustratore). First Edition. Ships in a BOX from Central Missouri! UPS shipping for most packages, (Priority Mail for AK/HI/APO/PO Boxes).
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Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Da: ThriftBooks-Dallas, Dallas, TX, U.S.A.
Valutazione del venditore 5 su 5 stelle
Paperback. Condizione: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
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Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Da: K & L KICKIN' BOOKS, Corinth, TX, U.S.A.
Valutazione del venditore 4 su 5 stelle
Prima edizione
Hardcover. Condizione sovraccoperta: no dust jacket. First Edition. Very good with slight shelf wear.
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LIFE LESSONS THROUGH A TEACHER'S EYE
Da: GreatBookPricesUK, Woodford Green, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 20,65
Spedizione EUR 17,29
Spedito da Regno Unito a U.S.A.Quantità: 13 disponibili
Aggiungi al carrelloCondizione: New. Julie Evans. Sarah Schultz (illustratore).
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Quality Conformance and Qualification of Microelectronic Packages and Interconnects Pecht, Michael G.; Dasgupta, Abhijit; Evans, John W. and Evans, Jillian Y.
Da: Librairie Parrêsia, Figeac, Francia
Valutazione del venditore 3 su 5 stelle
EUR 25,00
Spedizione EUR 32,50
Spedito da Francia a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloJan 05, 1995. Condizione: Used: Very Good. Quality Conformance and Qualification of Microelectronic Packages and Interconnects | Pecht et alii | Wiley & Sons, 1994, in-8 cartonnage éditeur sous jaquette, 461 pages. Couverture propre. Dos solide. Intérieur frais. Exemplaire de bibliothèque : petit code barre en pied de 1re de couv., cotation au dos, rares et discrets petits tampons à l'intérieur de l'ouvrage. Bel état ! [BT19].
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LIFE LESSONS THROUGH A TEACHER'S EYE
Da: GreatBookPricesUK, Woodford Green, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 72,72
Spedizione EUR 17,29
Spedito da Regno Unito a U.S.A.Quantità: 13 disponibili
Aggiungi al carrelloCondizione: As New. Julie Evans. Sarah Schultz (illustratore). Unread book in perfect condition.
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EUR 83,05
Spedizione EUR 17,86
Spedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: Very Good. Same / next day dispatch (Monday - Friday),
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Guide to Lead-free Solders : Physical Metallurgy And Reliability
Da: GreatBookPrices, Columbia, MD, U.S.A.
Valutazione del venditore 5 su 5 stelle
EUR 104,06
Spedizione EUR 2,26
Spedito in U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
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Product Integrity and Reliability in Design
Da: Lucky's Textbooks, Dallas, TX, U.S.A.
Valutazione del venditore 5 su 5 stelle
EUR 103,29
Spedizione EUR 3,42
Spedito in U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
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Guide to Lead-free Solders : Physical Metallurgy And Reliability
Da: GreatBookPrices, Columbia, MD, U.S.A.
Valutazione del venditore 5 su 5 stelle
EUR 121,66
Spedizione EUR 2,26
Spedito in U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
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Product Integrity and Reliability in Design
Da: Ria Christie Collections, Uxbridge, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 111,94
Spedizione EUR 13,81
Spedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
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Guide to Lead-free Solders : Physical Metallurgy And Reliability
Da: GreatBookPricesUK, Woodford Green, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 111,93
Spedizione EUR 17,29
Spedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
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Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Da: GreatBookPrices, Columbia, MD, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: New.
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EUR 138,71
Spedizione gratuita
Spedito in U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
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EUR 129,90
Spedizione EUR 9,95
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloHardcover Feb 28, 2001. Condizione: Used: Like New. Inkl. Rechnung nach §19; Buch stammt aus aufgelà ster Buchsammlung; Label, Stempel und Notizen mà glich.
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Guide to Lead-free Solders : Physical Metallurgy And Reliability
Da: GreatBookPricesUK, Woodford Green, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 128,11
Spedizione EUR 17,29
Spedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
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Product Integrity and Reliability in Design
Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
Valutazione del venditore 5 su 5 stelle
EUR 131,02
Spedizione EUR 10,50
Spedito da Irlanda a U.S.A.Quantità: 15 disponibili
Aggiungi al carrelloCondizione: New. Editor(s): Evans, John W.; Evans, Jillian Y. Num Pages: 402 pages, biography. BIC Classification: AKP; TBC; TBD; TGPQ. Category: (P) Professional & Vocational. Dimension: 235 x 156 x 25. Weight in Grams: 626. . 2012. Softcover reprint of the original 1st ed. 2001. Paperback. . . . .
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Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Da: Lucky's Textbooks, Dallas, TX, U.S.A.
Valutazione del venditore 5 su 5 stelle
EUR 156,51
Spedizione EUR 3,42
Spedito in U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
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Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Da: GreatBookPrices, Columbia, MD, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: As New. Unread book in perfect condition.
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Product Integrity and Reliability in Design
Lingua: Inglese
Editore: Springer London, Springer London Sep 2012, 2012
ISBN 10: 144711065X ISBN 13: 9781447110651
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
Valutazione del venditore 5 su 5 stelle
EUR 106,99
Spedizione EUR 60,00
Spedito da Germania a U.S.A.Quantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Neuware -Product Integrity and Reliability in Design is intended to serve either as a text for graduate students or as a reference for practicing engineers. The book develops the root-cause approach to reliability - often referred to as 'physics of failure' in the reliability engineering field. It approaches the subject from the point of view of a process and integrates the necessary methods to support that process. The book can be used to teach first- or second-year postgraduate students in mechanical, electrical, manufacturing and materials engineering about addressing issues of reliability during product development. It will also serve practicing engineers involved in the design and development of electrical and mechanical components and systems, as a reference.The book takes an interdisciplinary approach appropriate to system engineering, stressing concepts that can be integrated into design and placing less emphasis on traditional assumptions about reliability and analysis as a separate development activity. Several case studies emphasize the understanding of failure mechanisms and failure prevention and show how reliability methods, including simulation and testing can be integrated into design and development.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 420 pp. Englisch.
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Product Integrity and Reliability in Design
Da: Kennys Bookstore, Olney, MD, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: New. Editor(s): Evans, John W.; Evans, Jillian Y. Num Pages: 402 pages, biography. BIC Classification: AKP; TBC; TBD; TGPQ. Category: (P) Professional & Vocational. Dimension: 235 x 156 x 25. Weight in Grams: 626. . 2012. Softcover reprint of the original 1st ed. 2001. Paperback. . . . . Books ship from the US and Ireland.
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Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Da: Ria Christie Collections, Uxbridge, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 159,84
Spedizione EUR 13,81
Spedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
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Quality Conformance and Qualification of Microelectronic Packages and Interconnects (Paperback)
Lingua: Inglese
Editore: John Wiley & Sons Inc, New York, 1995
ISBN 10: 0471594369 ISBN 13: 9780471594369
Da: Grand Eagle Retail, Bensenville, IL, U.S.A.
Valutazione del venditore 5 su 5 stelle
Prima edizione
Paperback. Condizione: new. Paperback. All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful. * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate.wire and wire, tape automated,and flip-chip bonding.element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp. All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost--effective products should know that the paradigm has shifted. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
