Majhi prashant (35 risultati)

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Da: World of Books (was SecondSale), Montgomery, IL, U.S.A.World of Books (was SecondSale)
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Paperback. Condizione: New. This proceedings volume contains papers presented at Symposium I, 'Materials for End-of-Roadmap Scaling of CMOS Devices', and Symposium J, 'Materials and Devices for Beyond CMOS Scaling', held April 5-9 at the 2010 MRS Spring Meeting in San Francisco, California. These symposia attracted 106 presentat…ions, of which twenty-two were invited. Historically, scaling in Si CMOS was primarily led by lithography. In the last decade, this situation has been completely revolutionized with the introduction of the likes of copper interconnects, high-k gate dielectrics, metal gates, and strained silicon to meet the demands of the International Technology Roadmap for Semiconductors as the technology generations were reduced beyond 45 nm. As we look towards the end of the roadmap and beyond, the proliferation of potential solutions to meet the necessary performance challenges becomes truly staggering, and has motivated an exponential increase in research in a wide range of emerging materials and devices architectures.

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Da: California Books, Miami, FL, U.S.A.California Books
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Editore: New Delhi Publishers 2021
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Soft cover. Condizione: New. This book (Volume I) is a compilation of papers presented by various scholars in a national conference on "Relevance of Dr. B. R. Ambedkar for Inclusive Development in India" held on 14 April 2016 at Lipika Auditorium in Visva-Bharati, Santiniketan. It focuses on inclusive development, women empowerm…ent and social justice in India in the light of Dr. B. R. Ambedkar's thoughts and ideals. It has added a new contribution to development discourse and Ambedkar thoughts. It will be a useful resource not only for Ambedkarites but also for policy-makers, professionals, academicians, researchers and students engaged in the field of development in society.

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Condizione: New. pp. 162.

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Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

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Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandaKennys Bookshop and Art Galleries Ltd.
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Da: Rarewaves.com UK, London, Regno UnitoRarewaves.com UK
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Paperback. Condizione: New. This proceedings volume contains papers presented at Symposium I, 'Materials for End-of-Roadmap Scaling of CMOS Devices', and Symposium J, 'Materials and Devices for Beyond CMOS Scaling', held April 5-9 at the 2010 MRS Spring Meeting in San Francisco, California. These symposia attracted 106 presentat…ions, of which twenty-two were invited. Historically, scaling in Si CMOS was primarily led by lithography. In the last decade, this situation has been completely revolutionized with the introduction of the likes of copper interconnects, high-k gate dielectrics, metal gates, and strained silicon to meet the demands of the International Technology Roadmap for Semiconductors as the technology generations were reduced beyond 45 nm. As we look towards the end of the roadmap and beyond, the proliferation of potential solutions to meet the necessary performance challenges becomes truly staggering, and has motivated an exponential increase in research in a wide range of emerging materials and devices architectures.

Materials and Devices for End-of-Roadmap and Beyond CMOS Scaling
Ramanathan, Shriram (EDT); Guha, Supratik (EDT); Mannhart, Jochen (EDT); Kummel, Andrew C. (EDT); Watanabe, Heiji (EDT)
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This proceedings volume contains papers presented at Symposium I, 'Materials for End-of-Roadmap Scaling of CMOS Devices', and Symposium J, 'Materials and Devices for Beyond CMOS Scaling', held April 5-9 at the 2010 MRS Spring Meeting in San Franci…sco, California. These symposia attracted 106 presentations, of which twenty-two were invited. Historically, scaling in Si CMOS was primarily led by lithography. In the last decade, this situation has been completely revolutionized with the introduction of the likes of copper interconnects, high-k gate dielectrics, metal gates, and strained silicon to meet the demands of the International Technology Roadmap for Semiconductors as the technology generations were reduced beyond 45 nm. As we look towards the end of the roadmap and beyond, the proliferation of potential solutions to meet the necessary performance challenges becomes truly staggering, and has motivated an exponential increase in research in a wide range of emerging materials and devices architectures.

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Da: California Books, Miami, FL, U.S.A.California Books
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Condizione: New. In.

Materials and Devices for End-of-Roadmap and Beyond CMOS Scaling
Ramanathan, Shriram (EDT); Guha, Supratik (EDT); Mannhart, Jochen (EDT); Kummel, Andrew C. (EDT); Watanabe, Heiji (EDT)
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Materials and Devices for End-of-Roadmap and Beyond CMOS Scaling: Volume 1252 (MRS Proceedings)
. Ed(s): Ramanathan, Shriram; Guha, Supratik; Mannhart, Jochen; Kummel, Andrew C.; Watanabe, Heiji; Thayne, Iain; Majhi, Prashant; Bonafos, Caroline;
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Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandaKennys Bookshop and Art Galleries Ltd.
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Condizione: New. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. Editor(s): Ramanathan, Shriram; Guha, Supratik; Mannhart, Jochen; Kummel, Andrew C.; Watanabe, Heiji; Thayne, Iain; Majhi, Prashant; Bonafos, Caroline; Fujisaki, Yoshihisa; Dimitrakis, P. Se…ries: MRS Proceedings. Num Pages: Illustrations. BIC Classification: TGM. Category: (U) Tertiary Education (US: College). Dimension: 228 x 152 x 15. Weight in Grams: 364. . 2010. hardcover. . . . .

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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condizione: New. pp. ix + 149.

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Da: Revaluation Books, Exeter, Regno UnitoRevaluation Books
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Hardcover. Condizione: Brand New. 149 pages. 9.00x6.00x0.25 inches. In Stock.

Materials and Devices for End-of-Roadmap and Beyond CMOS Scaling: Volume 1252 (MRS Proceedings)
. Ed(s): Ramanathan, Shriram; Guha, Supratik; Mannhart, Jochen; Kummel, Andrew C.; Watanabe, Heiji; Thayne, Iain; Majhi, Prashant; Bonafos, Caroline;
- Rilegato
Da: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
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EUR 172,82
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Condizione: New. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. Editor(s): Ramanathan, Shriram; Guha, Supratik; Mannhart, Jochen; Kummel, Andrew C.; Watanabe, Heiji; Thayne, Iain; Majhi, Prashant; Bonafos, Caroline; Fujisaki, Yoshihisa; Dimitrakis, P. Se…ries: MRS Proceedings. Num Pages: Illustrations. BIC Classification: TGM. Category: (U) Tertiary Education (US: College). Dimension: 228 x 152 x 15. Weight in Grams: 364. . 2010. hardcover. . . . . Books ship from the US and Ireland.

Materials and Devices for End-of-Roadmap and Beyond CMOS Scaling
Ramanathan, Shriram (EDT); Guha, Supratik (EDT); Mannhart, Jochen (EDT); Kummel, Andrew C. (EDT); Watanabe, Heiji (EDT)
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EUR 159,00
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Hardcover. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Materials and Devices for End-of-Roadmap and Beyond CMOS Scaling
Ramanathan, Shriram (EDT); Guha, Supratik (EDT); Mannhart, Jochen (EDT); Kummel, Andrew C. (EDT); Watanabe, Heiji (EDT)
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Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Condizione: As New. Unread book in perfect condition.

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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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EUR 155,64
EUR 61,98 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This proceedings volume contains papers presented at Symposium I, 'Materials for End-of-Roadmap Scaling of CMOS Devices', and Symposium J, 'Materials and Devices for Beyond CMOS Scaling', held April 5-9 at the 2010 MRS Spring Meeting in San Francisco, Ca…lifornia. These symposia attracted 106 presentations, of which twenty-two were invited. Historically, scaling in Si CMOS was primarily led by lithography. In the last decade, this situation has been completely revolutionized with the introduction of the likes of copper interconnects, high-k gate dielectrics, metal gates, and strained silicon to meet the demands of the International Technology Roadmap for Semiconductors as the technology generations were reduced beyond 45 nm. As we look towards the end of the roadmap and beyond, the proliferation of potential solutions to meet the necessary performance challenges becomes truly staggering, and has motivated an exponential increase in research in a wide range of emerging materials and devices architectures.

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Paperback. Condizione: Brand New. 1st edition. 162 pages. 8.90x5.90x0.50 inches. In Stock. This item is printed on demand.

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Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
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Condizione: New. PRINT ON DEMAND pp. 162.

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- Print on Demand
Da: CitiRetail, Stevenage, Regno UnitoCitiRetail
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Paperback. Condizione: new. Paperback. This proceedings volume contains papers presented at Symposium I, 'Materials for End-of-Roadmap Scaling of CMOS Devices', and Symposium J, 'Materials and Devices for Beyond CMOS Scaling', held April 59 at the 2010 MRS Spring Meeting in San Francisco, California. These symposia attracted 106… presentations, of which twenty-two were invited. Historically, scaling in Si CMOS was primarily led by lithography. In the last decade, this situation has been completely revolutionized with the introduction of the likes of copper interconnects, high-k gate dielectrics, metal gates, and strained silicon to meet the demands of the International Technology Roadmap for Semiconductors as the technology generations were reduced beyond 45 nm. As we look towards the end of the roadmap and beyond, the proliferation of potential solutions to meet the necessary performance challenges becomes truly staggering, and has motivated an exponential increase in research in a wide range of emerging materials and devices architectures. This proceedings volume contains papers presented at Symposium I, 'Materials for End-of-Roadmap Scaling of CMOS Devices', and Symposium J, 'Materials and Devices for Beyond CMOS Scaling', held April 59 at the 2010 MRS Spring Meeting in San Francisco, California. These symposia attracted 106 presentations, of which twenty-two were invited. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.

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Da: moluna, Greven, Germaniamoluna
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Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This proceedings volume contains papers presented at Symposium I, Materials for End-of-Roadmap Scaling of CMOS Devices , and Symposium J, Materials and Devices for Beyond CMOS Scaling , held April 5-9 at the 2010 MRS… Spring Meeting in San Francisco, Calif.