puttlitz (31 risultati)

Condizione: good. Befriedigend/Good: Durchschnittlich erhaltenes Buch bzw. Schutzumschlag mit Gebrauchsspuren, aber vollständigen Seiten. / Describes the average WORN book or dust jacket that has all the pages present.

318 S., OBrosch., Taschenbuch., 2.Aufl., Einband etwas vergilbt., sonst gutes Exemplar., [Konv-dtv-5] Sprache: Deutsch 0 250 gr.

Bildgröße 11x9 cm.

Hardcover. Condizione: Very Good. 1st Edition. Signed by Paul A. Totta. Boards with superficial wear, light edge wear. Spine with some creasing toward tips. Internally clean and unmarked. Light soil to textblock edges. Due to weight of book, international orders cannot be accepted. Shelf 5c. Signed by Author(s).

Condizione: New.

Taschenbuch. Condizione: Neu. Area Array Interconnection Handbook | Paul A. Totta (u. a.) | Taschenbuch | 2 Taschenbücher | Englisch | 2012 | Springer US | EAN 9781461355298 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Microelectronic packaging has been recognized as an important 'enabler' for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.

Hardcover. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condizione: Good. Good++; Hardcover; Covers are clean and glossy; Couple of small spot-marks to the right textblock, otherwise unblemished textblock edges; Name on the front endpaper, otherwise endpapers and all text pages are clean and unmarked; The binding is excellent with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium-Large Format (Quatro, 9.75" - 10.75" tall); 4.3 lbs; Green covers with title in black lettering; 2004, CRC Press; 1048 pages; "Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (Mechanical Engineering)," by Karl J. Puttlitz & Kathleen A. Stalter.

Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Condizione: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings. In good all round condition. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,2050grams, ISBN:9780824748708.

Condizione: New.

Condizione: As New. Unread book in perfect condition.

Condizione: New.

Hardcover. Condizione: New.

Gebunden. Condizione: New. Karl J. Puttlitz, Kathleen A. StalterThis reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class.

Condizione: As New. Unread book in perfect condition.

Condizione: New. pp. xi + 1026.

Hardcover. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Buch. Condizione: Neu. Neuware - Presents a discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. This book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders.

Condizione: New. pp. xi + 1026.

8°, 228 S., Hlwd., Kanten, Ecken und rechter vorderer Buchdeckel beschabt, Bindung S. 16 zu S. 17 geplatzt, Schnitt fleckig. Zustand im Preis berücksicht, 24 Sprache: de.

Condizione: New. Print on Demand pp. 182.

128 S. Moderner Pappband. Goed. VI, 468, 67, 5. - Karl Friedrich Edler von Puttlitz (1777-1822) war preußischer Regierungsrat in Plock/Neu-Ostpreußen. Ging 1809 nach Wien. War später Regierungsrat in Kleve und 1820 Oberlandesgerichtsrat in Münster. - Gebräunt.

Hardcover. Condizione: Gut. Lederband, 26 Seiten, aus der Bibliothek von Alexander von Kluck, Marginalien,

37 Blätter (1 ausfaltbar), durchgehend ganzseitig bebildert. - Illustrierter kartonierter Originalumschlag mit Deckel- und Rückentitel; 8vo.(ca. 23 x 18 cm). *** [FRÜHLINGSVERKAUF-Endspurt, noch bis Montag den 25.05.2026 / Ultimate SPRING-SALE, only until Monday May 25th 2026: um über 40% REDUZIERTER PREIS / PRICE-REDUCTION of over 40%; ehemaliger Preis / previously EUR 280,-] --- 1. AUFLAGE, BROSCHIERTE ORIGINALAUSGABE DER OHNEHIN SELTENEN PUBLIKATION; *) HIER MIT MINDESTENS 35 ORIGINAL-UNTERSCHRIFTEN der dargestellten Künstler-innen, einige weitere scheinen nur im Druck signiert; bei wiederum einigen weiteren ist es nicht leicht zu erkennen, ob die Signatur original oder gedruckt ist. - Umschlag mit kleinen Stockfleckchen und vorne rechts etwas fingerfleckig, Titelblatt mit älterem handschriftlichen Entrag ''mit Unterschriften der Künstler / Wert 20 M''; GUTES EXEMPLAR.

LeatherBound. Condizione: NEW. LeatherBound edition. Condition: New. Reprinted from 1817 edition. Leather Binding on Spine and Corners with Golden leaf printing on spine. Bound in genuine leather with Satin ribbon page markers and Spine with raised gilt bands. A perfect gift for your loved ones. NO changes have been made to the original text. This is NOT a retyped or an ocr'd reprint. Illustrations, Index, if any, are included in black and white. Each page is checked manually before printing. As this print on demand book is reprinted from a very old book, there could be some missing or flawed pages, but we always try to make the book as complete as possible. Fold-outs, if any, are not part of the book. If the original book was published in multiple volumes then this reprint is of only one volume, not the whole set. Sewing binding for longer life, where the book block is actually sewn (smythe sewn/section sewn) with thread before binding which results in a more durable type of binding. Pages: 184.

Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Microelectronic packaging has been recognized as an important 'enabler' for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects. 1332 pp. Englisch.

Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Microelectronic packaging has been recognized as an important 'enabler' for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 1332 pp. Englisch.

Condizione: New. pp. xi + 1026 172 equations This item is printed on demand.