Puttlitz (21 risultati)
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Da: California Books, Miami, FL, U.S.A.California Books
Contatta il venditoreVenditore con 4 stelleCondizione: Nuovo
EUR 22,31
Spedizione gratuitaSpedito in U.S.A.Quantità: Più di 20 disponibili
Condizione: New.
- Rilegato
Da: medimops, Berlin, Germaniamedimops
Contatta il venditoreVenditore con 5 stelleCondizione: Usato - Buono
EUR 4,38
EUR 20,00 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Condizione: good. Befriedigend/Good: Durchschnittlich erhaltenes Buch bzw. Schutzumschlag mit Gebrauchsspuren, aber vollständigen Seiten. / Describes the average WORN book or dust jacket that has all the pages present.
Editore: München dtv, 1974
- Brossura
Da: buch-radel, Köln, Germaniabuch-radel
Contatta il venditoreVenditore con 5 stelleCondizione: Usato
EUR 4,50
EUR 17,00 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
318 S., OBrosch., Taschenbuch., 2.Aufl., Einband etwas vergilbt., sonst gutes Exemplar., [Konv-dtv-5] Sprache: Deutsch 0 250 gr.
Editore: Holzstich aus dem Jahr., 1893
Da: Antiquariat Hild, Weilburg, GermaniaAntiquariat Hild
Contatta il venditoreVenditore con 3 stelleCondizione: Usato
EUR 10,00
EUR 9,95 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloBildgröße 11x9 cm.
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- Brossura
Da: moluna, Greven, Germaniamoluna
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 48,37
EUR 48,99 spedizioneSpedito da Germania a U.S.A.Quantità: Più di 20 disponibili
Condizione: New.
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- Brossura
Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 53,49
EUR 72,32 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Microelectronic packaging has been recognized as an important 'enabler' for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and inte…rconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
- Rilegato
Da: Mispah books, Redhill, SURRE, Regno UnitoMispah books
Contatta il venditoreVenditore con 4 stelleCondizione: Usato - Come nuovo
EUR 196,21
EUR 29,22 spedizioneSpedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Hardcover. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Da: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 260,49
Spedizione gratuitaSpedito in U.S.A.Quantità: 1 disponibili
Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Lingua: Inglese
Editore: Marcel Dekker Inc, 2004
- Rilegato
Da: Anybook.com, Lincoln, Regno UnitoAnybook.com
Contatta il venditoreVenditore con 5 stelleCondizione: Usato - Buono
EUR 270,85
EUR 42,19 spedizioneSpedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Condizione: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings. In good all round condition. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,2050grams, ISBN:978082474870…8.
Editore: Deutscher Zentralverlag, Berlin, 1949
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Da: Buecherstube Eilert, Versandantiquariat, Dresden, DD, GermaniaBuecherstube Eilert, Versandantiquariat
Contatta il venditoreVenditore con 5 stelleCondizione: Usato
EUR 25,20
EUR 48,00 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrello8°, 228 S., Hlwd., Kanten, Ecken und rechter vorderer Buchdeckel beschabt, Bindung S. 16 zu S. 17 geplatzt, Schnitt fleckig. Zustand im Preis berücksicht, 24 Sprache: de.
- Brossura
- Print on Demand
Da: Majestic Books, Hounslow, Regno UnitoMajestic Books
Contatta il venditoreVenditore con 4 stelleCondizione: Nuovo
EUR 28,17
EUR 7,60 spedizioneSpedito da Regno Unito a U.S.A.Quantità: 4 disponibili
Condizione: New. Print on Demand pp. 182.
- Altre immagini
Editore: Münster, Aschendorff 1822., 1822
- Rilegato
Da: Antiquariat Uwe Turszynski, München, GermaniaAntiquariat Uwe Turszynski
Contatta il venditoreVenditore con 4 stelleCondizione: Usato
EUR 120,00
EUR 35,00 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrello128 S. Moderner Pappband. Goed. VI, 468, 67, 5. - Karl Friedrich Edler von Puttlitz (1777-1822) war preußischer Regierungsrat in Plock/Neu-Ostpreußen. Ging 1809 nach Wien. War später Regierungsrat in Kleve und 1820 Oberlandesgerichtsrat in Münster. - Gebräunt.
Lingua: Tedesco
Editore: Behr, Berlin, 1869
- Rilegato
Da: Antiquariat und Verlag Gerhard Henrich, Langenbieber, GermaniaAntiquariat und Verlag Gerhard Henrich
Contatta il venditoreVenditore con 5 stelleCondizione: Usato - Molto buono
EUR 30,00
EUR 80,00 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Gut. Lederband, 26 Seiten, aus der Bibliothek von Alexander von Kluck, Marginalien.
HUKA ALBUM: HUMORISTISCHER KÜNSTLER ABEND VON MITGLIEDERN DER KÖNIGL. HOFTHEATER DRESDEN (Umschlag) / (Titelblatt:) HUKA ALBUM ZUM BESTEN DER DEUTSCHEN BÜHNENGENOSSENSCHAFT. - Originalzeichnungen von Rudolf Scheffler: 'W. Gunz'*; 'E. Huff'*; 'H. Fischer'*; 'M. Steinmann'; 'L. v. Schuch'*; 'Th. Becker'; 'M. Mebus-Bleibtreu'*; 'L. Ermold'*; 'E. Plaschke v. d. Osten'*; 'A. Meyer'*; 'E. Rethberg'*; 'H. Kutzschbach'*; 'A. Dagny'* - 'F. Gerst'*; 'F. Reiner'*; 'M. Leithner'*; 'R. Scheffler'*; 'K. Striegler'*; 'A. Wierth'*; 'H. Rüdiger'* - 'G. Merrem-Nikisch'*; 'L. Rains'*; 'J. Puttlitz'*; 'M. v. Lussan'*; 'R. Tauber'*; 'W. B. Iltz'* - 'H. Forti'*; 'R. Burg'*; 'P. Wiecke'* - 'J. Schaffer-Bernstein'*; 'T. Pattiera'*; 'L. Fanto' - 'A. d'Arnais'; 'J. Pauli'; 'F. Hess'*; 'E. Ponto'*; 'H. Lange'* - 'G. Großmann'; 'Martens'* - 'Lewinsky'* - 'Paulsen' - 'Müller-Hanno'* - 'Schroeder' - '[C.] Jaedicke'* - u.a. --- UNIKAT, VON VIELEN* KÜNSTLER-INNE-N UNTER IHREM PORTRAIT EIGENHÄNDIG SIGNIERT. . .
RUDOLF SCHEFFLER (Karikaturist) / PORTRAITIERTE: . . . Altenkirch; Alexander d'Arnais; Theodor Becker; Robert Burg*; Alice Dagny*; Ludwig Ermold*; Leonhard Fanto; Hanns Fischer*; Helena Forti*; Fritz Gerst*; Gustav Großmann; Willy Gunz*; . . . Hasait; Frida Hess*; Eugen Huff*; Walter Bruno Iltz**; (Carl) Jaedicke*; Hermann Kutzschbach*; Hanns Lange*; Melitta Leithner*; . . . Lewinsky*; Margit von Lussan*; . . . Martens*; Maximiliane Mebus-Bleibtreu*; Grete Merrem-Nikisch*; Alfred Meyer*; . . . Meyer; . . . Müller-Hanno*; Tino Pattiera*; . . . Paulsen; Eva Plaschke-von der Osten*; Josef Pauli; Erich Ponto*; Julius Puttlitz*; Leon Rains; Fritz Reiner*; Elisabeth Rethberg*; Hans Rüdiger*; Jenny Schaffer-Bernstein*; . . . Schroeder; Liesel von Schuch*; Michael Steinmann; Kurt Striegler*; Richard Tauber*; . . . Toller; Paul Wiecke*; Alexander Wierth*; Robert . . . (?)* (Künstler-innen):
Editore: Dresden, Alfred Waldheim u. Co., 1918., 1918
- Firmato
Da: C O - L I B R I , Bremen - Berlin ; Deutschland / Germany ., Berlin, GermaniaC O - L I B R I , Bremen - Berlin ; Deutschland / Germany .
Contatta il venditoreVenditore con 5 stelleCondizione: Usato
EUR 160,00
EUR 45,00 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrello37 Blätter (1 ausfaltbar), durchgehend ganzseitig bebildert. - Illustrierter kartonierter Originalumschlag mit Deckel- und Rückentitel; 8vo.(ca. 23 x 18 cm). *** [Letztmalig ERWEITERTER SOMMERVERKAUF / Ultimately EXPANDED SUMMER-SALE: um über 40% Reduzierter Preis bis Montag, 10.08.2027 / PRICE-REDUCTION of over 40% until Monday…, August 10; ursprünglicher Preis / originally EUR 280,-] --- 1. AUFLAGE, BROSCHIERTE ORIGINALAUSGABE DER OHNEHIN SELTENEN PUBLIKATION; *) HIER MIT MINDESTENS 35 ORIGINAL-UNTERSCHRIFTEN der dargestellten Künstler-innen, einige weitere scheinen nur im Druck signiert; bei wiederum einigen weiteren ist es nicht leicht zu erkennen, ob die Signatur original oder gedruckt ist. - Umschlag mit kleinen Stockfleckchen und vorne rechts etwas fingerfleckig, Titelblatt mit älterem handschriftlichen Entrag ''mit Unterschriften der Künstler / Wert 20 M''; GUTES EXEMPLAR.
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- Print on Demand
Da: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 61,00
Spedizione gratuitaSpedito in U.S.A.Quantità: 10 disponibili
Condizione: Brand New. New. Delivery takes 20-25 days. Print on Demand.
- Altre immagini
- Rilegato
- Print on Demand
Da: True World of Books, Delhi, IndiaTrue World of Books
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 33,01
Spedizione gratuitaSpedito da India a U.S.A.Quantità: 18 disponibili
Aggiungi al carrelloLeatherBound. Condizione: NEW. LeatherBound edition. Condition: New. Reprinted from 1817 edition. Leather Binding on Spine and Corners with Golden leaf printing on spine. Bound in genuine leather with Satin ribbon page markers and Spine with raised gilt bands. A perfect gift for your loved ones. NO changes have been made to the…original text. This is NOT a retyped or an ocr'd reprint. Illustrations, Index, if any, are included in black and white. Each page is checked manually before printing. As this print on demand book is reprinted from a very old book, there could be some missing or flawed pages, but we always try to make the book as complete as possible. Fold-outs, if any, are not part of the book. If the original book was published in multiple volumes then this reprint is of only one volume, not the whole set. Sewing binding for longer life, where the book block is actually sewn (smythe sewn/section sewn) with thread before binding which results in a more durable type of binding. Pages: 184.
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- Print on Demand
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 53,49
EUR 23,00 spedizioneSpedito da Germania a U.S.A.Quantità: 2 disponibili
Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Microelectronic packaging has been recognized as an important 'enabler' for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external… wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects. 1332 pp. Englisch.
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- Brossura
- Print on Demand
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 53,49
EUR 60,00 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Microelectronic packaging has been recognized as an important 'enabler' for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wir…ing and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 1332 pp. Englisch.
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- Print on Demand
Da: preigu, Osnabrück, Germaniapreigu
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 50,25
EUR 70,00 spedizioneSpedito da Germania a U.S.A.Quantità: 5 disponibili
Taschenbuch. Condizione: Neu. Area Array Interconnection Handbook | Paul A. Totta (u. a.) | Taschenbuch | 2 Taschenbücher | Englisch | 2012 | Springer US | EAN 9781461355298 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu…Print on Demand.
Lingua: Inglese
Editore: CRC Press, 2004
- Rilegato
- Print on Demand
Da: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 414,01
Spedizione gratuitaSpedito in U.S.A.Quantità: Più di 20 disponibili
Condizione: Brand New. New. Delivery takes 20-25 days. Print on Demand.
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- Rilegato
- Print on Demand
Da: Gyan Books Pvt. Ltd., Delhi, IndiaGyan Books Pvt. Ltd.
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 64,23
Spedizione gratuitaSpedito da India a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloLeather Bound. Condizione: New. Presenting an Exquisite Leather-Bound Edition, expertly crafted with Original Natural Leather that gracefully adorns the spine and corners. The allure continues with Golden Leaf Printing that adds a touch of elegance, while Hand Embossing on the rounded spine lends an artistic flair. This masterpi…ece has been meticulously reprinted in 2025, utilizing the invaluable guidance of the original edition published many years ago in 1817. The contents of this book are presented in classic black and white. Its durability is ensured through a meticulous sewing binding technique, enhancing its longevity. Imprinted on top-tier quality paper. A team of professionals has expertly processed each page, delicately preserving its content without alteration. Due to the vintage nature of these books, every page has been manually restored for legibility. However, in certain instances, occasional blurriness, missing segments, or faint black spots might persist. We sincerely hope for your understanding of the challenges we faced with these books. Recognizing their significance for readers seeking insight into our historical treasure, we've diligently restored and reissued them. Our intention is to offer this valuable resource once again. We eagerly await your feedback, hoping that you'll find it appealing and will generously share your thoughts and recommendations. Pages:- 184, Print on Demand. If it is a multi-volume set, then it is only a single volume. We are specialised in Customisation of books, if you wish to opt different color leather binding, you may contact us. This service is chargeable. Product Disclaimer: Kindly be informed that, owing to the inherent nature of leather as a natural material, minor discolorations or textural variations may be perceptible. Explore the FOLIO EDITION (12x19 Inches): Available Upon Request. 184 184.
