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Environmental, Safety, and Health Issues in Ic Production : Symposium Held December 4-5, 1996, Boston, Massachusetts, U.S.A
Lingua: Inglese
Editore: Materials Research Society (MRS), 1997
ISBN 10: 1558993517 ISBN 13: 9781558993518
Da: GreatBookPrices, Columbia, MD, U.S.A.
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EUR 33,86
Spedizione EUR 2,28
Spedito in U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
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Environmental, Safety, and Health Issues in IC Production (Hardback or Cased Book)
Lingua: Inglese
Editore: Cambridge University Press 6/5/1997, 1997
ISBN 10: 1558993517 ISBN 13: 9781558993518
Da: BargainBookStores, Grand Rapids, MI, U.S.A.
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Hardback or Cased Book. Condizione: New. Environmental, Safety, and Health Issues in IC Production. Book.
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Environmental, Safety, and Health Issues in IC Production: Symposium Held December 4-5, 1996, Boston, Massachusetts, U.S.A (Materials Research Society Symposium Proceedings)
Lingua: Inglese
Editore: Materials Research Society (MRS), 1997
ISBN 10: 1558993517 ISBN 13: 9781558993518
Da: California Books, Miami, FL, U.S.A.
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EUR 36,43
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Spedito in U.S.A.Quantità: Più di 20 disponibili
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Environmental, safety, and health issues in IC Production
Lingua: Inglese
Editore: Materials Research Society, Pittsburgh, 1997
ISBN 10: 1558993517 ISBN 13: 9781558993518
Da: Cotswold Internet Books, Cheltenham, Regno Unito
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Prima edizione
EUR 23,37
Spedizione EUR 16,20
Spedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloCondizione: Used - Very Good. VG hardback. 1st ed. Materials Research Society Symposium Proceedings volume 447 (Symposium held Dec.1996 in Boston). No inscriptions, etc.; foot of spine a little bumped. Used - Very Good. VG hardback.
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MIT: A historical and architectural tour by Douglass Shand-Tucci
Libro 1 di 4: The Campus GuideLingua: Inglese
Editore: Princeton Architectural Press, New York, New York, 2016
ISBN 10: 1616892749 ISBN 13: 9781616892746
Da: Andover Books and Antiquities, Andover, MA, U.S.A.
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Softcover. Condizione: Very good condition. 400 pp. Campus Guides. Softcover. LCC: 2014049070.
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Environmental, Safety, and Health Issues in IC Production: Symposium Held December 4-5, 1996, Boston, Massachusetts, U.S.A (Materials Research Society Symposium Proceedings)
Lingua: Inglese
Editore: Materials Research Society (MRS), 1997
ISBN 10: 1558993517 ISBN 13: 9781558993518
Da: Ria Christie Collections, Uxbridge, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 36,16
Spedizione EUR 13,86
Spedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
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Environmental, Safety, and Health Issues in Ic Production : Symposium Held December 4-5, 1996, Boston, Massachusetts, U.S.A
Lingua: Inglese
Editore: Materials Research Society (MRS), 1997
ISBN 10: 1558993517 ISBN 13: 9781558993518
Da: GreatBookPricesUK, Woodford Green, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 36,14
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Spedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
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Environmental, Safety, and Health Issues in Ic Production: Symposium Held December 4-5, 1996, Boston, Massachusetts, U.S.A
Lingua: Inglese
Editore: Materials Research Society, 1997
ISBN 10: 1558993517 ISBN 13: 9781558993518
Da: Revaluation Books, Exeter, Regno Unito
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EUR 49,66
Spedizione EUR 11,57
Spedito da Regno Unito a U.S.A.Quantità: 2 disponibili
Aggiungi al carrelloHardcover. Condizione: Brand New. 154 pages. 9.00x6.25x0.75 inches. In Stock.
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Environmental, Safety, and Health Issues in IC Production: Volume 447
Lingua: Inglese
Editore: Materials Research Society, 1997
ISBN 10: 1558993517 ISBN 13: 9781558993518
Da: Kennys Bookstore, Olney, MD, U.S.A.
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EUR 67,81
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Spedito in U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. Editor(s): Bowling, Allen C.; Heyns, Marc; Reif, Rafael; Tonti, Alessandro. Series: MRS Proceedings. Num Pages: 168 pages, black & white illustrations. BIC Classification: KNXC; TGM. Category: (U) Tertiary Education (US: College). Dimension: 230 x 156 x 11. Weight in Grams: 400. . 1997. Hardback. . . . . Books ship from the US and Ireland.
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Environmental, Safety, and Health Issues in IC Production: Volume 447
Lingua: Inglese
Editore: Materials Research Society, 1997
ISBN 10: 1558993517 ISBN 13: 9781558993518
Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
Valutazione del venditore 5 su 5 stelle
EUR 77,29
Spedizione EUR 10,50
Spedito da Irlanda a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. Editor(s): Bowling, Allen C.; Heyns, Marc; Reif, Rafael; Tonti, Alessandro. Series: MRS Proceedings. Num Pages: 168 pages, black & white illustrations. BIC Classification: KNXC; TGM. Category: (U) Tertiary Education (US: College). Dimension: 230 x 156 x 11. Weight in Grams: 400. . 1997. Hardback. . . . .
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Wafer Level 3-d Ics Process Technology (integrated Circuits And Systems)
Libro 20 di 34: Integrated Circuits and SystemsDa: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
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Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Wafer Level 3-d Ics Process Technology (integrated Circuits And Systems)
Libro 20 di 34: Integrated Circuits and SystemsDa: Basi6 International, Irving, TX, U.S.A.
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Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Environmental, Safety, and Health Issues in IC Production
Lingua: Inglese
Editore: Cambridge University Press, 1997
ISBN 10: 1558993517 ISBN 13: 9781558993518
EUR 49,29
Spedizione EUR 62,02
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - It is clear that concern for the preservation of the environment is growing. The IC industry is reputed to be a clean one, and the introduction of electronic systems has played a pivotal role in developing technologies that help to protect the environment. However, it must also be realized that the electronic industry consumes huge amounts of energy, chemicals, technical gases and even water. This book provides an overview of the available scientific information on environmentally benign IC production. A broad range of topics is addressed including work on resource reduction for chemicals, gases and DI water, reuse or recycling of chemicals, waste treatment strategies, environmentally friendly alternative technologies and analytical technologies for environmental studies. Undoubtedly, environmental concerns are leading to drastic changes in state-of-the-art processing, and new technologies are emerging from the strive towards lowering the environmental impact of the IC industry.
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Environmental, Safety, and Health Issues in Ic Production : Symposium Held December 4-5, 1996, Boston, Massachusetts, U.S.A
Lingua: Inglese
Editore: Materials Research Society (MRS), 1997
ISBN 10: 1558993517 ISBN 13: 9781558993518
Da: GreatBookPricesUK, Woodford Green, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 96,55
Spedizione EUR 17,36
Spedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
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Environmental, Safety, and Health Issues in IC Production: Symposium Held December 4-5, 1996, Boston, Massachusetts, U.S.A (Materials Research Society Symposium Proceedings)
Lingua: Inglese
Editore: Materials Research Society (MRS), 1997
ISBN 10: 1558993517 ISBN 13: 9781558993518
Da: Mispah books, Redhill, SURRE, Regno Unito
Valutazione del venditore 4 su 5 stelle
EUR 87,02
Spedizione EUR 28,93
Spedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Environmental, Safety, and Health Issues in Ic Production : Symposium Held December 4-5, 1996, Boston, Massachusetts, U.S.A
Lingua: Inglese
Editore: Materials Research Society (MRS), 1997
ISBN 10: 1558993517 ISBN 13: 9781558993518
Da: GreatBookPrices, Columbia, MD, U.S.A.
Valutazione del venditore 5 su 5 stelle
EUR 117,38
Spedizione EUR 2,28
Spedito in U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
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COUNTLESS CONNECTING THREADS. MIT'S HISTORY REVEALED THROUGH ITS MOST EVOCATIVE OBJECTS A Catalog of the MIT 150 Exhibition presented by the MIT Museum as part of the Institutes's Sesquicentennial Celebration in 2011.
Lingua: Inglese
Editore: MIT Museum, Cambridge, Massachusets, 2013
ISBN 10: 026202666X ISBN 13: 9780262026666
Da: Frey Fine Books, Rougemont, NC, U.S.A.
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Prima edizione
Hardcover. Condizione: Fine. Condizione sovraccoperta: Near Fine. 1st edition. 1st edition thus, 2013. A Fine Book in a Near Fine dust jacket. 4to., 235 pp., bound in publishers red cloth with illustrated dust jacket. Minor signs of shelf wear to jacket. Text is clean and unmarked, dust jacket now protected in mylar sleeve.
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Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)
Libro 20 di 34: Integrated Circuits and SystemsDa: Ria Christie Collections, Uxbridge, Regno Unito
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EUR 164,32
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Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)
Da: Ria Christie Collections, Uxbridge, Regno Unito
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EUR 164,32
Spedizione EUR 13,86
Spedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
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Wafer Level 3-D ICs Process Technology
Libro 20 di 34: Integrated Circuits and SystemsDa: GreatBookPrices, Columbia, MD, U.S.A.
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Condizione: New.
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Wafer Level 3-d Ics Process Technology
Da: GreatBookPrices, Columbia, MD, U.S.A.
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Condizione: New.
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Wafer Level 3-D ICS Process Technology
Da: Books Puddle, New York, NY, U.S.A.
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Condizione: New. pp. 376.
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EUR 140,00
Spedizione EUR 70,00
Spedito da Germania a U.S.A.Quantità: 5 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Wafer Level 3-D ICS Process Technology | Chuan Seng Tan (u. a.) | Taschenbuch | xii | Englisch | 2010 | Springer Us | EAN 9781441945624 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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EUR 168,73
Spedizione EUR 62,63
Spedito da Germania a U.S.A.Quantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry's vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamental motivation behind 3D technologies which vertically stack several strata of device and interconnect layers with high vertical interconnectivity. In addition, the ability to vertically stack strata with - vergent and even incompatible process ows provides for low cost and low parasitic integration of diverse technologies such as sensors, energy scavengers, nonvolatile memory, dense memory, fast memory, processors, and RF layers. These capabilities coupled with today's trends of increasing levels of integrated functionality, lower power, smaller form factor, increasingly divergent process ows, and functional diversi cation would seem to make 3D technologies a natural choice for most of the semiconductor industry. Since the concept of vertical integration of different strata has been around for over 20 years, why aren't vertically stacked strata endemic to the semiconductor industry The simple answer to this question is that in the past, the 3D advantages while interesting were not necessary due to the tremendous opportunities offered by geometric scaling. In addition, even when the global interconnect problem of high-performance single-core processors seemed insurmountable without inno- tions such as 3D, alternative architectural solutions such as multicores could eff- tivelydelaybutnoteliminatetheneedfor3D.
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EUR 168,73
Spedizione EUR 63,65
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry's vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamental motivation behind 3D technologies which vertically stack several strata of device and interconnect layers with high vertical interconnectivity. In addition, the ability to vertically stack strata with - vergent and even incompatible process ows provides for low cost and low parasitic integration of diverse technologies such as sensors, energy scavengers, nonvolatile memory, dense memory, fast memory, processors, and RF layers. These capabilities coupled with today's trends of increasing levels of integrated functionality, lower power, smaller form factor, increasingly divergent process ows, and functional diversi cation would seem to make 3D technologies a natural choice for most of the semiconductor industry. Since the concept of vertical integration of different strata has been around for over 20 years, why aren't vertically stacked strata endemic to the semiconductor industry The simple answer to this question is that in the past, the 3D advantages while interesting were not necessary due to the tremendous opportunities offered by geometric scaling. In addition, even when the global interconnect problem of high-performance single-core processors seemed insurmountable without inno- tions such as 3D, alternative architectural solutions such as multicores could eff- tivelydelaybutnoteliminatetheneedfor3D.
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Wafer Level 3-D ICs Process Technology (Series on Integrated Circuits and Systems)
Libro 20 di 34: Integrated Circuits and SystemsDa: Revaluation Books, Exeter, Regno Unito
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EUR 236,11
Spedizione EUR 14,47
Spedito da Regno Unito a U.S.A.Quantità: 2 disponibili
Aggiungi al carrelloHardcover. Condizione: Brand New. 1st edition. 410 pages. 9.75x9.50x0.75 inches. In Stock.
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Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)
Libro 20 di 34: Integrated Circuits and SystemsDa: Mispah books, Redhill, SURRE, Regno Unito
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EUR 243,18
Spedizione EUR 28,93
Spedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Wafer Level 3-D ICs Process Technology
Libro 20 di 34: Integrated Circuits and SystemsDa: GreatBookPrices, Columbia, MD, U.S.A.
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Condizione: As New. Unread book in perfect condition.
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Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)
Da: Mispah books, Redhill, SURRE, Regno Unito
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EUR 259,87
Spedizione EUR 28,93
Spedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Wafer Level 3-d Ics Process Technology
Da: GreatBookPrices, Columbia, MD, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: As New. Unread book in perfect condition.
