Suny li (32 risultati)
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Da: Rarewaves.com USA, London, LONDO, Regno UnitoRarewaves.com USA
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Hardback. Condizione: New. An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity…, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies designFlipChip and RDL designRouting and coppering3D Real-Time DRC checkSiP simulation technologyMentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.
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Da: Buchpark, Trebbin, GermaniaBuchpark
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Condizione: Hervorragend. Zustand: Hervorragend | Seiten: 892 | Sprache: Englisch | Produktart: Bücher | This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new origin…al concepts and thoughts, such as Function Density Law,Si³P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging. Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification. Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance forthe research and development of SiP projects. This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case. Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.
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Da: California Books, Miami, FL, U.S.A.California Books
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Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
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Altre immagini- Brossura
Da: preigu, Osnabrück, Germaniapreigu
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Taschenbuch. Condizione: Neu. MicroSystem Based on SiP Technology | Suny Li | Taschenbuch | xviii | Englisch | 2023 | Springer Singapore | EAN 9789811900853 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Da: Rarewaves.com UK, London, Regno UnitoRarewaves.com UK
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Hardback. Condizione: New. An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity…, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies designFlipChip and RDL designRouting and coppering3D Real-Time DRC checkSiP simulation technologyMentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.
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Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
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Da: Revaluation Books, Exeter, Regno UnitoRevaluation Books
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Paperback. Condizione: Brand New. 892 pages. 9.25x6.10x1.76 inches. In Stock.
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Da: California Books, Miami, FL, U.S.A.California Books
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Da: BUCHSERVICE / ANTIQUARIAT Lars Lutzer, Wahlstedt, GermaniaBUCHSERVICE / ANTIQUARIAT Lars Lutzer
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Hardcover. Condizione: gut. 2022. MicroSystem Based on SiP Technology In deutscher Sprache. pages.
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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EUR 300,12
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Condizione: New. 1st ed. 2022 edition NO-PA16APR2015-KAP.
Lingua: Inglese
Editore: Springer Nature Singapore, Springer Nature Singapore, 2022
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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EUR 240,56
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Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts and thoughts, suc…h as Function Density Law,Si P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging.Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification.Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance forthe research and development of SiP projects.This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case.Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.
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Da: Mispah books, Redhill, SURRE, Regno UnitoMispah books
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Hardcover. Condizione: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Da: PBShop.store UK, Fairford, GLOS, Regno UnitoPBShop.store UK
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HRD. Condizione: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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Da: THE SAINT BOOKSTORE, Southport, Regno UnitoTHE SAINT BOOKSTORE
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Hardback. Condizione: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
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Da: CitiRetail, Stevenage, Regno UnitoCitiRetail
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Hardcover. Condizione: new. Hardcover. An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die st…acks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies designFlipChip and RDL designRouting and coppering3D Real-Time DRC checkSiP simulation technologyMentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools. An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
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Da: moluna, Greven, Germaniamoluna
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EUR 141,30
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Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. A comprehensive SiP design guide bookDescribes the whole process of SiPCombines the original concepts, hot technology and practical casesMr. Suny Li (Li Yang) is a SiP technical expert with 20 years of working experi…ence. He has .
Lingua: Inglese
Editore: Springer Nature Singapore, Springer Nature Singapore Mai 2023, 2023
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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EUR 171,19
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Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original con…cepts and thoughts, such as Function Density Law,Si P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging.Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification.Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance forthe research and development of SiP projects.This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case.Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it. 892 pp. Englisch.
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Da: Majestic Books, Hounslow, Regno UnitoMajestic Books
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Condizione: New. Print on Demand.
Lingua: Inglese
Editore: Springer Nature Singapore, Springer Nature Singapore Mai 2023, 2023
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
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EUR 171,19
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Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters.In Part one, the author proposes some new original concepts… and thoughts, such as Function Density Law,Si P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging.Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification.Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance forthe research and development of SiP projects.This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case.Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 892 pp. Englisch.
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Da: Majestic Books, Hounslow, Regno UnitoMajestic Books
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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EUR 171,19
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Taschenbuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts… and thoughts, such as Function Density Law,Si P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging.Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification.Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance forthe research and development of SiP projects.This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case.Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.
Lingua: Inglese
Editore: Springer, Berlin|Springer Nature Singapore|Publishing House of Electronics Industry|Springer, 2022
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Da: moluna, Greven, Germaniamoluna
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EUR 192,60
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Gebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author propo…ses some new original concepts and though.
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Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
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EUR 234,57
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Condizione: New. PRINT ON DEMAND.
Lingua: Inglese
Editore: Springer Nature Singapore, Springer Nature Singapore Mai 2022, 2022
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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EUR 235,39
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Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts a…nd thoughts, such as Function Density Law,Si P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging.Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification.Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance forthe research and development of SiP projects.This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case.Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it. 892 pp. Englisch.
Lingua: Inglese
Editore: Springer Nature Singapore, Springer Nature Singapore Mai 2022, 2022
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 235,39
EUR 60,00 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Buch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters.In Part one, the author proposes some new original concepts and th…oughts, such as Function Density Law,Si P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging.Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification.Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance forthe research and development of SiP projects.This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case.Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 892 pp. Englisch.
