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3D Microelectronic Packaging: From Fundamentals to Applications: 57 (Springer Series in Advanced Microelectronics)
Prima edizione
EUR 66,00
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Aggiungi al carrelloHardcover. Condizione: Sehr gut. 1. Auflage. Unread book in excellent condition. Language - English. Ships from Berlin. - This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
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3d Microelectronic Packaging : From Architectures to Applications
Da: GreatBookPrices, Columbia, MD, U.S.A.
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EUR 168,26
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3d Microelectronic Packaging : From Architectures to Applications
Da: GreatBookPricesUK, Woodford Green, Regno Unito
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3D Microelectronic Packaging: From Architectures to Applications (Springer Series in Advanced Microelectronics, 64)
Da: Ria Christie Collections, Uxbridge, Regno Unito
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3d Microelectronic Packaging : From Architectures to Applications
Da: GreatBookPrices, Columbia, MD, U.S.A.
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EUR 198,58
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3d Microelectronic Packaging : From Architectures to Applications
Da: GreatBookPricesUK, Woodford Green, Regno Unito
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EUR 197,68
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3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics, 57)
Da: Ria Christie Collections, Uxbridge, Regno Unito
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EUR 199,19
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EUR 154,00
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. 3D Microelectronic Packaging | From Fundamentals to Applications | Yan Li (u. a.) | Taschenbuch | Springer Series in Advanced Microelectronics | ix | Englisch | 2018 | Springer | EAN 9783319830865 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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3D Microelectronic Packaging: From Fundamentals to Applications: 57 (Springer Series in Advanced Microelectronics)
Da: Books Puddle, New York, NY, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: New. Softcover reprint of the original 1st ed. 2017 edition NO-PA16APR2015-KAP.
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3D Microelectronic Packaging: From Architectures to Applications (Springer Series in Advanced Microelectronics (64))
Da: Books Puddle, New York, NY, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: New.
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EUR 166,90
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. 3D Microelectronic Packaging | From Architectures to Applications | Yan Li (u. a.) | Taschenbuch | Springer Series in Advanced Microelectronics | xvii | Englisch | 2021 | Springer | EAN 9789811570926 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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3D Microelectronic Packaging: From Architectures to Applications (Springer Series in Advanced Microelectronics, 64)
Da: Books Puddle, New York, NY, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: New. 2nd ed. 2021 edition NO-PA16APR2015-KAP.
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3D Microelectronic Packaging : From Fundamentals to Applications
Lingua: Inglese
Editore: Springer International Publishing, Springer International Publishing, 2018
ISBN 10: 3319830864 ISBN 13: 9783319830865
EUR 192,59
Spedizione EUR 63,58
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
-
3D Microelectronic Packaging: From Architectures to Applications (Springer Series in Advanced Microelectronics, 64)
Da: Mispah books, Redhill, SURRE, Regno Unito
Valutazione del venditore 4 su 5 stelle
EUR 239,35
Spedizione EUR 28,90
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Aggiungi al carrelloHardcover. Condizione: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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EUR 203,27
Spedizione EUR 64,78
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
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EUR 203,27
Spedizione EUR 65,58
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
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3d Microelectronic Packaging: From Architectures to Applications
Da: Revaluation Books, Exeter, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 280,44
Spedizione EUR 17,34
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Aggiungi al carrelloHardcover. Condizione: Brand New. 2nd edition. 639 pages. 9.25x6.10x1.50 inches. In Stock.
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3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics, 57)
Da: Mispah books, Redhill, SURRE, Regno Unito
Valutazione del venditore 4 su 5 stelle
EUR 265,55
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Aggiungi al carrelloPaperback. Condizione: New. New. book.
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3D Microelectronic Packaging (eng)
Da: Brook Bookstore On Demand, Napoli, NA, Italia
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EUR 150,28
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Spedito da Italia a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: new. Questo è un articolo print on demand.
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3D Microelectronic Packaging (eng)
Da: Brook Bookstore On Demand, Napoli, NA, Italia
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EUR 150,28
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Spedito da Italia a U.S.A.Quantità: Più di 20 disponibili
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3D Microelectronic Packaging (eng)
Da: Brook Bookstore On Demand, Napoli, NA, Italia
Valutazione del venditore 4 su 5 stelle
EUR 150,28
Spedizione EUR 11,00
Spedito da Italia a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: new. Questo è un articolo print on demand.
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EUR 162,51
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Aggiungi al carrelloGebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides comprehensive coverage of 3D microelectronic packages Explains the fundamentals of using solder interconnects as micro-bumps Demonstrates the advanced materials and processes used in 3D microelectronic packages Introd.
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3D Microelectronic Packaging
Lingua: Inglese
Editore: Springer, Berlin|Springer Nature Singapore|Springer, 2021
ISBN 10: 9811570922 ISBN 13: 9789811570926
EUR 162,51
Spedizione EUR 48,99
Spedito da Germania a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.This book off.
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3D Microelectronic Packaging
Lingua: Inglese
Editore: Springer International Publishing, 2018
ISBN 10: 3319830864 ISBN 13: 9783319830865
EUR 162,51
Spedizione EUR 48,99
Spedito da Germania a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic pack.
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3D Microelectronic Packaging
Lingua: Inglese
Editore: Springer, Springer Nov 2021, 2021
ISBN 10: 9811570922 ISBN 13: 9789811570926
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
Valutazione del venditore 5 su 5 stelle
EUR 192,59
Spedizione EUR 23,00
Spedito da Germania a U.S.A.Quantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development. 640 pp. Englisch.
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3D Microelectronic Packaging
Lingua: Inglese
Editore: Springer, Springer Nov 2020, 2020
ISBN 10: 9811570892 ISBN 13: 9789811570896
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
Valutazione del venditore 5 su 5 stelle
EUR 192,59
Spedizione EUR 23,00
Spedito da Germania a U.S.A.Quantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development. 640 pp. Englisch.
-
3D Microelectronic Packaging
Lingua: Inglese
Editore: Springer International Publishing Jul 2018, 2018
ISBN 10: 3319830864 ISBN 13: 9783319830865
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
Valutazione del venditore 5 su 5 stelle
EUR 192,59
Spedizione EUR 23,00
Spedito da Germania a U.S.A.Quantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. 476 pp. Englisch.
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3D Microelectronic Packaging: From Fundamentals to Applications: 57 (Springer Series in Advanced Microelectronics)
Da: Majestic Books, Hounslow, Regno Unito
Valutazione del venditore 4 su 5 stelle
EUR 226,61
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3D Microelectronic Packaging: From Fundamentals to Applications: 57 (Springer Series in Advanced Microelectronics)
Da: Biblios, Frankfurt am main, HESSE, Germania
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EUR 228,60
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3D Microelectronic Packaging: From Architectures to Applications (Springer Series in Advanced Microelectronics (64))
Da: Majestic Books, Hounslow, Regno Unito
Valutazione del venditore 4 su 5 stelle
EUR 243,05
Spedizione EUR 7,51
Spedito da Regno Unito a U.S.A.Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. Print on Demand This item is printed on demand.
