9780470662540 - advanced interconnects for ulsi technology (15 risultati)
- Rilegato
Da: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 148,77
Spedizione gratuitaSpedito in U.S.A.Quantità: 1 disponibili
Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Advanced Interconnects for ULSI Technology
Baklanov, Mikhail R. (EDT); Ho, Paul S. (EDT); Zschech, Ehrenfried (EDT)
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Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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EUR 174,02
EUR 2,31 spedizioneSpedito in U.S.A.Quantità: 3 disponibili
Condizione: New.
Advanced Interconnects for ULSI Technology Format: Hardcover
Mikhail Baklanov (IMEC); Paul S. Ho (University of Texas at Austin); Ehrenfried Zschech (Fraunhofer Inst. for Non-Destr. Testing)
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Da: INDOO, Avenel, NJ, U.S.A.INDOO
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EUR 176,41
Spedizione gratuitaSpedito in U.S.A.Quantità: Più di 20 disponibili
Condizione: New. Brand New.
Advanced Interconnects for ULSI Technology
Baklanov, Mikhail R. (EDT); Ho, Paul S. (EDT); Zschech, Ehrenfried (EDT)
- Rilegato
Da: GreatBookPricesUK, Woodford Green, Regno UnitoGreatBookPricesUK
Contatta il venditoreVenditore con 5 stelleCondizione: Usato - Come nuovo
EUR 198,94
EUR 17,56 spedizioneSpedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Condizione: As New. Unread book in perfect condition.
- Rilegato
Da: Mispah books, Redhill, SURRE, Regno UnitoMispah books
Contatta il venditoreVenditore con 4 stelleCondizione: Usato - Come nuovo
EUR 189,30
EUR 29,27 spedizioneSpedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Hardcover. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Advanced Interconnects for ULSI Technology
Baklanov, Mikhail R. (EDT); Ho, Paul S. (EDT); Zschech, Ehrenfried (EDT)
- Rilegato
Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contatta il venditoreVenditore con 5 stelleCondizione: Usato - Come nuovo
EUR 222,05
EUR 2,31 spedizioneSpedito in U.S.A.Quantità: 3 disponibili
Condizione: As New. Unread book in perfect condition.
- Rilegato
- Prima edizione
Da: Grand Eagle Retail, Bensenville, IL, U.S.A.Grand Eagle Retail
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 234,05
Spedizione gratuitaSpedito in U.S.A.Quantità: 1 disponibili
Hardcover. Condizione: new. Hardcover. Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a sing…le chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirementsLow-k materials: fundamentals, advances and mechanical propertiesConductive layers and barriersIntegration and reliability including mechanical reliability, electromigration and electrical breakdownNew approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Advanced Interconnects for ULSI Technology
Baklanov, Mikhail R. (EDT); Ho, Paul S. (EDT); Zschech, Ehrenfried (EDT)
- Rilegato
Da: GreatBookPricesUK, Woodford Green, Regno UnitoGreatBookPricesUK
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 236,44
EUR 17,56 spedizioneSpedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Condizione: New.
- Rilegato
Da: Ubiquity Trade, Miami, FL, U.S.A.Ubiquity Trade
Contatta il venditoreVenditore con 4 stelleCondizione: Nuovo
EUR 253,84
EUR 2,62 spedizioneSpedito in U.S.A.Quantità: Più di 20 disponibili
Condizione: New. Brand new! Please provide a physical shipping address.
Advanced Interconnects for ULSI Technology
. Ed(s): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried
- Rilegato
Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandaKennys Bookshop and Art Galleries Ltd.
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 252,27
EUR 10,50 spedizioneSpedito da Irlanda a U.S.A.Quantità: 15 disponibili
Condizione: New. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Editor(s): Baklanov, Mikhail R.…; Ho, Paul S.; Zschech, Ehrenfried. Num Pages: 606 pages, Illustrations. BIC Classification: TJFD. Category: (P) Professional & Vocational. Dimension: 248 x 171 x 32. Weight in Grams: 1058. . 2012. . . . .
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Da: moluna, Greven, Germaniamoluna
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 233,70
EUR 48,99 spedizioneSpedito da Germania a U.S.A.Quantità: Più di 20 disponibili
Condizione: New. Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over.
- Rilegato
- Prima edizione
Da: CitiRetail, Stevenage, Regno UnitoCitiRetail
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 255,00
EUR 43,31 spedizioneSpedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Hardcover. Condizione: new. Hardcover. Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a sing…le chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirementsLow-k materials: fundamentals, advances and mechanical propertiesConductive layers and barriersIntegration and reliability including mechanical reliability, electromigration and electrical breakdownNew approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
Advanced Interconnects for ULSI Technology
. Ed(s): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried
- Rilegato
Da: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 317,17
EUR 9,18 spedizioneSpedito in U.S.A.Quantità: 15 disponibili
Condizione: New. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Editor(s): Baklanov, Mikhail R.…; Ho, Paul S.; Zschech, Ehrenfried. Num Pages: 606 pages, Illustrations. BIC Classification: TJFD. Category: (P) Professional & Vocational. Dimension: 248 x 171 x 32. Weight in Grams: 1058. . 2012. . . . . Books ship from the US and Ireland.
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- Edizione Internazionale
Da: UK BOOKS STORE, London, LONDO, Regno UnitoUK BOOKS STORE
Contatta il venditoreVenditore con 5 stelleEdizione InternazionaleCondizione: Nuovo
EUR 329,29
Spedizione gratuitaSpedito da Regno Unito a U.S.A.Quantità: 3 disponibili
Condizione: New. Brand New! Fast Delivery This is an International Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 6-10 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested if t…he Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.
- Rilegato
- Prima edizione
Da: AussieBookSeller, Truganina, VIC, AustraliaAussieBookSeller
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 364,34
EUR 32,34 spedizioneSpedito da Australia a U.S.A.Quantità: 1 disponibili
Hardcover. Condizione: new. Hardcover. Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a sing…le chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirementsLow-k materials: fundamentals, advances and mechanical propertiesConductive layers and barriersIntegration and reliability including mechanical reliability, electromigration and electrical breakdownNew approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
