9780930815257 - reliability and yield problems of wire bonding in microelectronics: the application of materials and interface science di harman, george (8 risultati)

Condizione: Very Good. Very Good condition. A copy that may have a few cosmetic defects. May also contain light spine creasing or a few markings such as an owner's name, short gifter's inscription or light stamp.

Condizione: Good. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Condizione: Good. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Hardcover. Condizione: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.

Hardcover. Condizione: Fine. hardback book in fine condition.

Hardcover. Condizione: Fine. hardback book in fine condition.

hardcover. Condizione: Very Good. DUST JACKET. Pages are crisp and clean, no marking. Cover is verygood. Binding is tight/good.

Hardcover. Condizione: New. In shrink wrap. Looks like an interesting title.