ISBN: 9789811336263 - modeling and application of flexible electronics packaging (10 risultati)

Condizione: As New. Unread book in perfect condition.

Condizione: New. In English.

Condizione: New.

Condizione: New.

Hardcover. Condizione: Brand New. 308 pages. 9.25x6.10x0.94 inches. In Stock.

Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Is the first book available on modeling and applications of transfer printing of flexible electronicsIncludes multiple processes developed according to the geometric shape of chips and devicesOffers detailed modeling and computation steps f.…

Buch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This book systematically discusses the modeling and application oftransfer manipulationfor flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of theequipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field ofmicroelectronics.…

Buch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 308 pp. Englisch.…

Condizione: New. Print on Demand.

Condizione: New. PRINT ON DEMAND.