Condizione: Good. 150 pp., Hardcover, ex library else text clean and binding tight. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.
Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Da: Hamelyn, Madrid, M, Spagna
EUR 60,63
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: Bueno. : A lo largo de los años, ha habido un gran aumento en la funcionalidad disponible en un solo circuito integrado. Esto se ha logrado principalmente mediante un impulso continuo hacia tamaños de características más pequeños, matrices más grandes y una mejor eficiencia de empaquetado. Sin embargo, esta mayor funcionalidad también ha resultado en aumentos sustanciales en la inversión de capital necesaria para construir instalaciones de fabricación. Dada una inversión tan alta, es fundamental para los fabricantes de circuitos integrados reducir los costos de fabricación y obtener un mejor retorno de su inversión. El método más obvio para reducir el costo de fabricación por matriz es mejorar el rendimiento de fabricación. La investigación e ingeniería modernas de VLSI (que incluyen el diseño, la fabricación y las pruebas) abarcan una gama muy amplia de disciplinas como la química, la física, la ciencia de los materiales, el diseño de circuitos, las matemáticas y la informática. Debido a esta diversidad, el campo de VLSI se ha fracturado en una serie de subdominios separados con poca o ninguna interacción entre ellos. Este es el caso de las relaciones entre las pruebas y la fabricación. De la contaminación a los defectos, las fallas y la pérdida de rendimiento: la simulación y las aplicaciones se centra en el núcleo de la interfaz entre la fabricación y las pruebas, es decir, la relación contaminación-defecto-falla. La comprensión de esta relación puede conducir a mejores soluciones de muchos problemas de fabricación y pruebas. Se desarrollan y presentan modelos de mecanismos de falla que se pueden utilizar para estimar con precisión la probabilidad de diferentes fallas para un circuito integrado dado. Esta información es fundamental para resolver aplicaciones clave relacionadas con el rendimiento, como el análisis de fallas, el modelado de fallas y la fabricación de diseños. EAN: 9781461285953 Tipo: Libros Categoría: Tecnología Título: From Contamination to Defects, Faults and Yield Loss Autor: Jitendra B. Khare Idioma: eng Páginas: 168.
hardcover. Condizione: New. In shrink wrap. Looks like an interesting title!
Da: GreatBookPrices, Columbia, MD, U.S.A.
EUR 120,20
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 117,41
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 117,41
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Aggiungi al carrelloCondizione: New. In.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 117,40
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Aggiungi al carrelloCondizione: New.
Da: GreatBookPrices, Columbia, MD, U.S.A.
EUR 133,12
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Aggiungi al carrelloCondizione: New.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 126,96
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Lingua: Inglese
Editore: Kluwer Academic Publishers, 1996
ISBN 10: 0792397142 ISBN 13: 9780792397144
Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
EUR 132,56
Quantità: 15 disponibili
Aggiungi al carrelloCondizione: New. States that over the years there has been a large increase in the functionality available on a single integrated circuit. This book focuses on the core of the interface between manufacturing and testing, ie, the contamination-defect-fault relationship. Series: Frontiers in Electronic Testing. Num Pages: 166 pages, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 234 x 156 x 11. Weight in Grams: 930. . 1996. Hardback. . . . .
Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. pp. 172.
Da: Buchpark, Trebbin, Germania
EUR 61,27
Quantità: 2 disponibili
Aggiungi al carrelloCondizione: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | Over the years there has been a large increase in the functionality available on a single integrated circuit. This has been mainly achieved by a continuous drive towards smaller feature sizes, larger dies, and better packing efficiency. However, this greater functionality has also resulted in substantial increases in the capital investment needed to build fabrication facilities. Given such a high level of investment, it is critical for IC manufacturers to reduce manufacturing costs and get a better return on their investment. The most obvious method of reducing the manufacturing cost per die is to improve manufacturing yield. Modern VLSI research and engineering (which includes design manufacturing and testing) encompasses a very broad range of disciplines such as chemistry, physics, material science, circuit design, mathematics and computer science. Due to this diversity, the VLSI arena has become fractured into a number of separate sub-domains with little or no interaction between them. This is the case with the relationships between testing and manufacturing. From Contamination to Defects, Faults and Yield Loss: Simulation and Applications focuses on the core of the interface between manufacturing and testing, i.e., the contamination-defect-fault relationship. The understanding of this relationship can lead to better solutions of many manufacturing and testing problems. Failure mechanism models are developed and presented which can be used to accurately estimate probability of different failures for a given IC. This information is critical in solving key yield-related applications such as failure analysis, fault modeling and design manufacturing.
Lingua: Inglese
Editore: Kluwer Academic Publishers, 1996
ISBN 10: 0792397142 ISBN 13: 9780792397144
Da: Kennys Bookstore, Olney, MD, U.S.A.
Condizione: New. States that over the years there has been a large increase in the functionality available on a single integrated circuit. This book focuses on the core of the interface between manufacturing and testing, ie, the contamination-defect-fault relationship. Series: Frontiers in Electronic Testing. Num Pages: 166 pages, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 234 x 156 x 11. Weight in Grams: 930. . 1996. Hardback. . . . . Books ship from the US and Ireland.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 167,24
Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Da: Celler Versandantiquariat, Eicklingen, Germania
Membro dell'associazione: GIAQ
EUR 14,00
Quantità: 1 disponibili
Aggiungi al carrelloKluwer Academic Publishers, Boston, 1996. 150 pages, Paperback--- - former library book in good condition - 468 Gramm.
Da: Basi6 International, Irving, TX, U.S.A.
EUR 92,85
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: Brand New. New. US edition. Print on demand title. Delivery takes 20-25 days.
Da: Brook Bookstore On Demand, Napoli, NA, Italia
EUR 86,24
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: new. Questo è un articolo print on demand.
Da: moluna, Greven, Germania
EUR 92,27
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Over the years there has been a large increase in the functionality available on a single integrated circuit. This has been mainly achieved by a continuous drive towards smaller feature sizes, larger dies, and better packing efficiency. However, this gre.
Da: moluna, Greven, Germania
EUR 92,27
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Over the years there has been a large increase in the functionality available on a single integrated circuit. This has been mainly achieved by a continuous drive towards smaller feature sizes, larger dies, and better packing efficiency. However, this gre.
Da: Majestic Books, Hounslow, Regno Unito
EUR 153,34
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. Print on Demand pp. 172 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
Da: Biblios, Frankfurt am main, HESSE, Germania
EUR 153,79
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. PRINT ON DEMAND pp. 172.
Da: preigu, Osnabrück, Germania
EUR 95,70
Quantità: 5 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. From Contamination to Defects, Faults and Yield Loss | Simulation and Applications | Jitendra B. Khare (u. a.) | Taschenbuch | Frontiers in Electronic Testing | xvi | Englisch | 2011 | Springer | EAN 9781461285953 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
Da: preigu, Osnabrück, Germania
EUR 95,70
Quantità: 5 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. From Contamination to Defects, Faults and Yield Loss | Simulation and Applications | Jitendra B. Khare (u. a.) | Buch | Frontiers in Electronic Testing | Einband - fest (Hardcover) | Englisch | 1996 | Springer | EAN 9780792397144 | Verantwortliche Person für die EU: Springer Nature Customer Service Center GmbH, Europaplatz 3, 69115 Heidelberg, productsafety[at]springernature[dot]com | Anbieter: preigu Print on Demand.