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paperback. Condizione: As New. No highlighting. Very minimal wear.
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Business Success Secrets: Entrepreneurial Thinking That Works
Da: Greenworld Books, Arlington, TX, U.S.A.
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Condizione: very_good. Fast Free Shipping â" Very Good condition book with a firm cover and clean pages. Shows normal use and some light wear or limited notes markings. A solid, nice copy to enjoy.
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Business Success Secrets: Entrepreneurial Thinking That Works
Da: Blue Vase Books, Interlochen, MI, U.S.A.
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Condizione: good. The item shows wear from consistent use, but it remains in good condition and works perfectly. All pages and cover are intact including the dust cover, if applicable . Spine may show signs of wear. Pages may include limited notes and highlighting. May NOT include discs, access code or other supplemental materials.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10-12, ... California, U.S.A. (MRS Proceedings)
Lingua: Inglese
Editore: Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Da: California Books, Miami, FL, U.S.A.
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EUR 41,51
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Spedito in U.S.A.Quantità: Più di 20 disponibili
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10-12, ... California, U.S.A. (MRS Proceedings)
Lingua: Inglese
Editore: Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Da: Ria Christie Collections, Uxbridge, Regno Unito
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EUR 36,75
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Understanding Government Budgets : A Guide to Practices in the Public Service
Da: GreatBookPrices, Columbia, MD, U.S.A.
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Condizione: As New. Unread book in perfect condition.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 10-12, 2007, San . U.S.A.: Volume 990 (MRS Proceedings)
Lingua: Inglese
Editore: Cambridge University Press 2014-06-05, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Da: Chiron Media, Wallingford, Regno Unito
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EUR 35,71
Spedizione EUR 17,87
Spedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloPaperback. Condizione: New.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 10-12, 2007, San Francisco, California, U.S.A. (MRS Proceedings)
Lingua: Inglese
Editore: Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
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EUR 44,84
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Spedito da Irlanda a U.S.A.Quantità: Più di 20 disponibili
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro - and Nanoelectronics
Lingua: Inglese
Editore: Cambridge University Press CUP, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Da: Books Puddle, New York, NY, U.S.A.
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Condizione: New. pp. 358.
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Understanding Government Budgets : A Guide to Practices in the Public Service
Da: GreatBookPrices, Columbia, MD, U.S.A.
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Condizione: New.
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Understanding Government Budgets: A Guide to Practices in the Public Service, 2ND EDITION
Da: Books Puddle, New York, NY, U.S.A.
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Condizione: New.
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Understanding Government Budgets: A Guide to Practices in the Public Service, 2ND EDITION
Da: Majestic Books, Hounslow, Regno Unito
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EUR 56,13
Spedizione EUR 7,50
Spedito da Regno Unito a U.S.A.Quantità: 3 disponibili
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 10?12, 2007, San Francisco, California, U.S.A. (MRS Proceedings)
Lingua: Inglese
Editore: Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Da: Kennys Bookstore, Olney, MD, U.S.A.
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EUR 55,05
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Understanding Government Budgets : A Guide to Practices in the Public Service
Da: GreatBookPricesUK, Woodford Green, Regno Unito
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EUR 53,54
Spedizione EUR 17,31
Spedito da Regno Unito a U.S.A.Quantità: 10 disponibili
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Understanding Government Budgets: A Guide to Practices in the Public Service
Da: Revaluation Books, Exeter, Regno Unito
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EUR 81,84
Spedizione EUR 11,54
Spedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: Brand New. 2nd new edition. 136 pages. 0.04x0.04x0.04 inches. In Stock.
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EUR 56,54
Spedizione EUR 48,99
Spedito da Germania a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloKartoniert / Broschiert. Condizione: New. Public budgets follow rules of presentation and use terms that make sense to few outside the world of public finance. Moreover, practices vary widely among the thousands of governments across the globe, between federal, state, and local levels of governm.
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Understanding Government Budgets : A Guide to Practices in the Public Service
Da: GreatBookPricesUK, Woodford Green, Regno Unito
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EUR 101,44
Spedizione EUR 17,31
Spedito da Regno Unito a U.S.A.Quantità: 10 disponibili
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics : Volume 990: Symposium Held April 10 12, 20
Lingua: Inglese
Editore: Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
EUR 55,77
Spedizione EUR 62,60
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node devices - have a transistor gate length of less than 50nm. This rapid technological advancement in the semiconductor industry has been made possible by innovations in materials employed in both transistor fabrication (front-end-of-the-line, FEOL) and interconnect fabrication (back-end-of-the-line, BEOL). The 90nm node BEOL features copper (Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node and beyond, evolutionary and revolutionary innovations in BEOL materials and processes are needed to fuel the continued, healthy growth of the semiconductor. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.
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Understanding Government Budgets : A Guide to Practices in the Public Service
Da: GreatBookPrices, Columbia, MD, U.S.A.
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Condizione: As New. Unread book in perfect condition.
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Understanding Government Budgets : A Guide to Practices in the Public Service
Da: GreatBookPrices, Columbia, MD, U.S.A.
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Condizione: New.
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Understanding Government Budgets : A Guide to Practices in the Public Service
Da: GreatBookPricesUK, Woodford Green, Regno Unito
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EUR 188,45
Spedizione EUR 17,31
Spedito da Regno Unito a U.S.A.Quantità: 10 disponibili
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Understanding Government Budgets : A Guide to Practices in the Public Service
Da: GreatBookPricesUK, Woodford Green, Regno Unito
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EUR 212,62
Spedizione EUR 17,31
Spedito da Regno Unito a U.S.A.Quantità: 10 disponibili
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EUR 187,38
Spedizione EUR 48,99
Spedito da Germania a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloGebunden. Condizione: New. Public budgets follow rules of presentation and use terms that make sense to few outside the world of public finance. Moreover, practices vary widely among the thousands of governments across the globe, between federal, state, and local levels of governm.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990 (Paperback)
Lingua: Inglese
Editore: Cambridge University Press, Cambridge, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Da: Grand Eagle Retail, Bensenville, IL, U.S.A.
Valutazione del venditore 5 su 5 stelle
Paperback. Condizione: new. Paperback. In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node devices - have a transistor gate length of less than 50nm. This rapid technological advancement in the semiconductor industry has been made possible by innovations in materials employed in both transistor fabrication (front-end-of-the-line, FEOL) and interconnect fabrication (back-end-of-the-line, BEOL). The 90nm node BEOL features copper (Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node and beyond, evolutionary and revolutionary innovations in BEOL materials and processes are needed to fuel the continued, healthy growth of the semiconductor. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 10-12, 2007, San Francisco, California, U.S.A.: Volume 990
Lingua: Inglese
Editore: Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Da: Revaluation Books, Exeter, Regno Unito
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EUR 35,27
Spedizione EUR 11,54
Spedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: Brand New. 1st edition. 358 pages. 9.02x5.98x0.75 inches. In Stock. This item is printed on demand.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10-12, 2007, San Francisco, California, U.S.A.
Lingua: Inglese
Editore: Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Da: THE SAINT BOOKSTORE, Southport, Regno Unito
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EUR 41,04
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Spedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloPaperback / softback. Condizione: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro - and Nanoelectronics
Lingua: Inglese
Editore: Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Da: Majestic Books, Hounslow, Regno Unito
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EUR 53,58
Spedizione EUR 7,50
Spedito da Regno Unito a U.S.A.Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. Print on Demand pp. 358.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro - and Nanoelectronics
Lingua: Inglese
Editore: Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Da: Biblios, Frankfurt am main, HESSE, Germania
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EUR 54,57
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Spedito da Germania a U.S.A.Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. PRINT ON DEMAND pp. 358.
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Understanding Government Budgets: A Guide to Practices in the Public Service, 2ND EDITION
Da: Biblios, Frankfurt am main, HESSE, Germania
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EUR 62,44
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990 (Paperback)
Lingua: Inglese
Editore: Cambridge University Press, Cambridge, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Da: CitiRetail, Stevenage, Regno Unito
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EUR 44,55
Spedizione EUR 42,69
Spedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: new. Paperback. In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node devices - have a transistor gate length of less than 50nm. This rapid technological advancement in the semiconductor industry has been made possible by innovations in materials employed in both transistor fabrication (front-end-of-the-line, FEOL) and interconnect fabrication (back-end-of-the-line, BEOL). The 90nm node BEOL features copper (Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node and beyond, evolutionary and revolutionary innovations in BEOL materials and processes are needed to fuel the continued, healthy growth of the semiconductor. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
