defect oriented testing nano metric cmos (27 risultati)

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Taschenbuch. Condizione: Neu. Defect-Oriented Testing for Nano-Metric CMOS VLSI Circuits | José Pineda de Gyvez (u. a.) | Taschenbuch | xxi | Englisch | 2010 | Springer US | EAN 9781441942852 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Buch. Condizione: Neu. Neuware -Defect-oriented testing methods have come a long way from a mere interesting academic exercise to a hard industrial reality. Many factors have contributed to its industrial acceptance. Traditional approaches of testing modern integrated circuits have been found to be inadequate in terms of quality and economics of test. In a globally competitive semiconductor market place, overall product quality and economics have become very important objectives. In addition, electronic systems are becoming increasingly complex and demand components of the highest possible quality. Testing in general and defect-oriented testing in particular help in realizing these objectives. For contemporary System on Chip (SoC) VLSI circuits, testing is an activity associated with every level of integration. However, special emphasis is placed for wafer-level test, and final test. Wafer-level test consists primarily of dc or slow-speed tests with current/voltage checks per pin under most operating conditions and with test limits properly adjusted. Basic digital tests are applied and in some cases low-frequency tests to ensure analog/RF functionality are exercised as well. Final test consists of checking device functionality by exercising RF tests and by applying a comprehensive suite of digital test methods such as I , delay fault testing, DDQ stuck-at testing, low-voltage testing, etc. This partitioning choice is actually application dependent.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 352 pp. Englisch.

Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Defect-oriented testing methods have come a long way from a mere interesting academic exercise to a hard industrial reality. Many factors have contributed to its industrial acceptance. Traditional approaches of testing modern integrated circuits have been found to be inadequate in terms of quality and economics of test. In a globally competitive semiconductor market place, overall product quality and economics have become very important objectives. In addition, electronic systems are becoming increasingly complex and demand components of the highest possible quality. Testing in general and defect-oriented testing in particular help in realizing these objectives. For contemporary System on Chip (SoC) VLSI circuits, testing is an activity associated with every level of integration. However, special emphasis is placed for wafer-level test, and final test. Wafer-level test consists primarily of dc or slow-speed tests with current/voltage checks per pin under most operating conditions and with test limits properly adjusted. Basic digital tests are applied and in some cases low-frequency tests to ensure analog/RF functionality are exercised as well. Final test consists of checking device functionality by exercising RF tests and by applying a comprehensive suite of digital test methods such as I , delay fault testing, DDQ stuck-at testing, low-voltage testing, etc. This partitioning choice is actually application dependent.

Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Defect-oriented testing methods have come a long way from a mere interesting academic exercise to a hard industrial reality. Many factors have contributed to its industrial acceptance. Traditional approaches of testing modern integrated circuits have been found to be inadequate in terms of quality and economics of test. In a globally competitive semiconductor market place, overall product quality and economics have become very important objectives. In addition, electronic systems are becoming increasingly complex and demand components of the highest possible quality. Testing in general and defect-oriented testing in particular help in realizing these objectives. For contemporary System on Chip (SoC) VLSI circuits, testing is an activity associated with every level of integration. However, special emphasis is placed for wafer-level test, and final test. Wafer-level test consists primarily of dc or slow-speed tests with current/voltage checks per pin under most operating conditions and with test limits properly adjusted. Basic digital tests are applied and in some cases low-frequency tests to ensure analog/RF functionality are exercised as well. Final test consists of checking device functionality by exercising RF tests and by applying a comprehensive suite of digital test methods such as I , delay fault testing, DDQ stuck-at testing, low-voltage testing, etc. This partitioning choice is actually application dependent.

Paperback. Condizione: Brand New. 2nd edition. 349 pages. 9.10x6.10x0.90 inches. In Stock.

Hardcover. Condizione: Brand New. 2nd edition. 328 pages. 9.25x6.25x0.75 inches. In Stock.

Paperback. Condizione: Like New. Like New. book.

Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Wide coverage of topics in test engineeringUnique defect-oriented focus of the materialsIntroduction to yield engineering common practicesThe 2nd edition of defect oriented testing has been extensively updated. New cha.

Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Wide coverage of topics in test engineeringUnique defect-oriented focus of the materialsIntroduction to yield engineering common practicesThe 2nd edition of defect oriented testing has been extensively updated. New cha.

Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The 2nd edition of defect oriented testing has been extensively updated. New chapters on Functional, Parametric Defect Models and Inductive fault Analysis and Yield Engineering have been added to provide a link between defect sources and yield. The chapter on RAM testing has been updated with focus on parametric and SRAM stability testing. Similarly, newer material has been incorporated in digital fault modeling and analog testing chapters. The strength of Defect Oriented Testing for nano-Metric CMOS VLSIs lies in its industrial relevance. 352 pp. Englisch.

Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Defect-oriented testing methods have come a long way from a mere interesting academic exercise to a hard industrial reality. Many factors have contributed to its industrial acceptance. Traditional approaches of testing modern integrated circuits have been found to be inadequate in terms of quality and economics of test. In a globally competitive semiconductor market place, overall product quality and economics have become very important objectives. In addition, electronic systems are becoming increasingly complex and demand components of the highest possible quality. Testing in general and defect-oriented testing in particular help in realizing these objectives. For contemporary System on Chip (SoC) VLSI circuits, testing is an activity associated with every level of integration. However, special emphasis is placed for wafer-level test, and final test. Wafer-level test consists primarily of dc or slow-speed tests with current/voltage checks per pin under most operating conditions and with test limits properly adjusted. Basic digital tests are applied and in some cases low-frequency tests to ensure analog/RF functionality are exercised as well. Final test consists of checking device functionality by exercising RF tests and by applying a comprehensive suite of digital test methods such as I , delay fault testing, DDQ stuck-at testing, low-voltage testing, etc. This partitioning choice is actually application dependent. 352 pp. Englisch.

Buch. Condizione: Neu. Defect-Oriented Testing for Nano-Metric CMOS VLSI Circuits | José Pineda de Gyvez (u. a.) | Buch | xxi | Englisch | 2007 | Copernicus | EAN 9780387465463 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.

Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Defect-oriented testing methods have come a long way from a mere interesting academic exercise to a hard industrial reality. Many factors have contributed to its industrial acceptance. Traditional approaches of testing modern integrated circuits have been found to be inadequate in terms of quality and economics of test. In a globally competitive semiconductor market place, overall product quality and economics have become very important objectives. In addition, electronic systems are becoming increasingly complex and demand components of the highest possible quality. Testing in general and defect-oriented testing in particular help in realizing these objectives. For contemporary System on Chip (SoC) VLSI circuits, testing is an activity associated with every level of integration. However, special emphasis is placed for wafer-level test, and final test. Wafer-level test consists primarily of dc or slow-speed tests with current/voltage checks per pin under most operating conditions and with test limits properly adjusted. Basic digital tests are applied and in some cases low-frequency tests to ensure analog/RF functionality are exercised as well. Final test consists of checking device functionality by exercising RF tests and by applying a comprehensive suite of digital test methods such as I , delay fault testing, DDQ stuck-at testing, low-voltage testing, etc. This partitioning choice is actually application dependent.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 352 pp. Englisch.

Condizione: New. PRINT ON DEMAND pp. 352.