Lingua: Inglese
Editore: Cambridge University Press, 2014
ISBN 10: 1107413141 ISBN 13: 9781107413146
Da: California Books, Miami, FL, U.S.A.
EUR 41,61
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Da: Antiquariat Thomas Haker GmbH & Co. KG, Berlin, Germania
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EUR 28,08
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Aggiungi al carrelloSoftcover/Paperback. 400 p. Very good. Shrink wrapped. / Sehr guter Zustand. In Folie verschweißt. Sprache: Englisch Gewicht in Gramm: 760.
Lingua: Inglese
Editore: Cambridge University Press, 2014
ISBN 10: 1107413141 ISBN 13: 9781107413146
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 38,06
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Aggiungi al carrelloCondizione: New. In.
Lingua: Inglese
Editore: Cambridge University Press 2014-06-05, 2014
ISBN 10: 1107413141 ISBN 13: 9781107413146
Da: Chiron Media, Wallingford, Regno Unito
EUR 34,21
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Aggiungi al carrelloPaperback. Condizione: New.
Lingua: Inglese
Editore: Cambridge University Press, 2014
ISBN 10: 1107413141 ISBN 13: 9781107413146
Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
EUR 43,23
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Aggiungi al carrelloCondizione: New.
Lingua: Inglese
Editore: Cambridge University Press CUP, 2014
ISBN 10: 1107413141 ISBN 13: 9781107413146
Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. pp. 176.
Da: Antiquariat Thomas Haker GmbH & Co. KG, Berlin, Germania
Membro dell'associazione: GIAQ
Prima edizione
EUR 35,28
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Aggiungi al carrelloPaperback. Condizione: Wie neu. 1st ed. 412 S.; Ill. Like new. Shrink wrapped. Sprache: Englisch Gewicht in Gramm: 825.
Lingua: Inglese
Editore: Cambridge University Press, 2014
ISBN 10: 1107413141 ISBN 13: 9781107413146
Da: Kennys Bookstore, Olney, MD, U.S.A.
EUR 53,16
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Da: Alplaus Books, Alplaus, NY, U.S.A.
Paperback. Condizione: Good. Solid State Phenomena, Vols. 65-66. Name on first page, else no markings noted. Gentle usage wear.
Lingua: Inglese
Editore: Cambridge University Press, 2014
ISBN 10: 1107413141 ISBN 13: 9781107413146
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 52,69
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. Other emerging applications for this technology include flat-panel displays, magnetic data storage and microelectromechanical systems. The rapid emergence of copper as the conducting material for integrated circuits has further pushed CMP technology to the forefront of semiconductor manufacturing. However, a basic understanding of the CMP process, which is necessary to enable further advances, is inadequate. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured. Topics include: CMP mechanisms; dielectric and metal CMP; process integration and manufacturability; and CMP consumables.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 253,78
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Aggiungi al carrelloPaperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 346,72
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Aggiungi al carrelloPaperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 390,80
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Aggiungi al carrelloPaperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Lingua: Inglese
Editore: Cambridge University Press, Cambridge, 2014
ISBN 10: 1107413141 ISBN 13: 9781107413146
Da: Grand Eagle Retail, Bensenville, IL, U.S.A.
Paperback. Condizione: new. Paperback. Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. Other emerging applications for this technology include flat-panel displays, magnetic data storage and microelectromechanical systems. The rapid emergence of copper as the conducting material for integrated circuits has further pushed CMP technology to the forefront of semiconductor manufacturing. However, a basic understanding of the CMP process, which is necessary to enable further advances, is inadequate. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured. Topics include: CMP mechanisms; dielectric and metal CMP; process integration and manufacturability; and CMP consumables. Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Lingua: Inglese
Editore: Cambridge University Press, 2014
ISBN 10: 1107413141 ISBN 13: 9781107413146
Da: Revaluation Books, Exeter, Regno Unito
EUR 35,36
Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: Brand New. 176 pages. 9.00x6.00x0.40 inches. In Stock. This item is printed on demand.
Da: Antiquariaat Wim de Goeij, Kalmthout, ANTW, Belgio
Membro dell'associazione: ILAB
EUR 49,00
Quantità: 1 disponibili
Aggiungi al carrello2. Bruxelles, Editions Labor, Editions Isy Brachot, 1992, in-4°, 143 pp, coloured ills., publisher's cased binding with an illustrated dust jacket. Text in French but with translations in English, German and Dutch.
Da: Antiquariaat Wim de Goeij, Kalmthout, ANTW, Belgio
Membro dell'associazione: ILAB
EUR 56,00
Quantità: 1 disponibili
Aggiungi al carrello3. Bruxelles, Editions Labor, Editions Isy Brachot, 1992, in-4°, 143 pp, coloured ills., publisher's cased binding with an illustrated dust jacket. Text in French but with translations in English, German and Dutch.
Lingua: Inglese
Editore: Cambridge University Press, 2014
ISBN 10: 1107413141 ISBN 13: 9781107413146
Da: THE SAINT BOOKSTORE, Southport, Regno Unito
EUR 41,15
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Aggiungi al carrelloPaperback / softback. Condizione: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
Lingua: Inglese
Editore: Cambridge University Press, 2014
ISBN 10: 1107413141 ISBN 13: 9781107413146
Da: Majestic Books, Hounslow, Regno Unito
EUR 50,55
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. Print on Demand pp. 176.
Lingua: Inglese
Editore: Cambridge University Press, 2014
ISBN 10: 1107413141 ISBN 13: 9781107413146
Da: Biblios, Frankfurt am main, HESSE, Germania
EUR 51,70
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. PRINT ON DEMAND pp. 176.
Lingua: Inglese
Editore: Cambridge University Press, Cambridge, 2014
ISBN 10: 1107413141 ISBN 13: 9781107413146
Da: CitiRetail, Stevenage, Regno Unito
EUR 44,66
Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: new. Paperback. Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. Other emerging applications for this technology include flat-panel displays, magnetic data storage and microelectromechanical systems. The rapid emergence of copper as the conducting material for integrated circuits has further pushed CMP technology to the forefront of semiconductor manufacturing. However, a basic understanding of the CMP process, which is necessary to enable further advances, is inadequate. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured. Topics include: CMP mechanisms; dielectric and metal CMP; process integration and manufacturability; and CMP consumables. Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
Lingua: Inglese
Editore: Cambridge University Press, 2013
ISBN 10: 1107413141 ISBN 13: 9781107413146
Da: moluna, Greven, Germania
EUR 42,05
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Aggiungi al carrelloCondizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. This book, first published in 2001, provides an insight into the fundamental p.
Lingua: Inglese
Editore: Cambridge University Press, Cambridge, 2014
ISBN 10: 1107413141 ISBN 13: 9781107413146
Da: AussieBookSeller, Truganina, VIC, Australia
EUR 64,46
Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: new. Paperback. Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. Other emerging applications for this technology include flat-panel displays, magnetic data storage and microelectromechanical systems. The rapid emergence of copper as the conducting material for integrated circuits has further pushed CMP technology to the forefront of semiconductor manufacturing. However, a basic understanding of the CMP process, which is necessary to enable further advances, is inadequate. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured. Topics include: CMP mechanisms; dielectric and metal CMP; process integration and manufacturability; and CMP consumables. Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured. This item is printed on demand. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.